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PRODUCT SPECIFICATION
RC5055
3
Absolute Maximum Ratings
Operating Conditions
Thermal Information
Parameter
Power Input Voltage, Vin
Supply Voltage Vcc
Boot Voltage, V
BOOT
-V
PHASE
I/O Voltages
ESD Classification
Min.
Max.
6V
13.5V
13.5V
Vin+0.3V
Class 2
GND-0.3V
Parameter
Supply Voltage
Ambient Temperature
Junction Temperature
Min.
Max.
+12+10%
70°C
125°C
+12V -10%
0°C
0°C
Parameter
Thermal Resistance,
Conditions
Min.
Typ.
80
89
Max.
°C/W
JA
SOIC
SSOP
Maximum Junction Temperature
Storage Temperature
Maximum Lead Temperature
150
°
C
150
°
C
300
°
C
-65
°
C
Soldering 10 Seconds
Electrical Specifications
(V
CC
=12V, F
OSC
=200KHz and T
A
=25°C using circuit in figure 1, unless otherwise noted)
Parameter
PWM Section
VCC Supply Current
Nominal Supply
Power-On Reset
Rising VCC Threshold
Falling VCC Threshold
Rising V
OCSET
Threshold
Oscillator
Free Running Frequency
Ramp Amplitude
Reference and DAC
Input Voltage Setpoint
Symbol
Test Conditions
Min.
Typ.
Max.
Units
I
CC
UGATE and LGATE Open
–
24
35
mA
V
OCSET
= 4.5V
V
OCSET
= 4.5V
–
–
–
10.4
–
–
V
V
V
8.8
–
1.26
F
S
RT = OPEN
RT = OPEN
185
–
200
1.9
215
–
kHz
V
P-P
V
OSC
I
LOAD = 0.8A
, V
OUT
=2.000V
VOUT=1.550V
1.980
1.534
2.000
1.550
2.020
1.566
V
V
Error Amplifier
DC Gain
Gain-Bandwidth Product
Slew Rate
A
DC
GBW
SR
–
–
–
88
15
6
–
–
–
dB
MHz
V/
μ
s
COMP = 10pF
Θ