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R1154x
6
R1154x001C
Topt
=25°C
Symbol
Item
Conditions
Min.
Typ.
Max.
Unit
VIN
Input Voltage
24
V
VOUT
Output Voltage
VIN
=VOUT+2.0V, IOUT=20mA
2.45
2.50
2.55
V
IOUT
Output Current
VIN
=VOUT+2.0V
140
mA
ISS
Supply Current
VIN
=VOUT+2.0V, VCE=VIN
5
10
μA
Istandby
Standby Current
VIN
=24V, VCE=0V
0.1
1.0
μA
ΔVOUT/ΔIOUT
Load regulation
VIN
=VOUT+2.0V,
1mA
≤ IOUT ≤ 40mA
20
50
mV
ΔVOUT/ΔVIN
Line regulation
VOUT
+1V ≤ VIN ≤ 24V,
IOUT
=20mA
0.05
0.20
%/V
VDIF
Dropout Voltage
IOUT
=20mA
0.20
0.40
V
ΔVOUT/
ΔTopt
Output Voltage
Temperature Coefficient
VIN
=VOUT+2.0V, IOUT=20mA,
40°C ≤ Topt ≤ 105°C
±100
ppm/
°C
ISC
Short Current Limit
VOUT
=0V
45
mA
VCEH
CE “H” Input Voltage
2.1
VIN
V
VCEL
CE “L” Input Voltage
0
0.3
V
TSD
Thermal Shutdown
Temperature
Junction Temperature
150
°C
TSR
Thermal Shutdown
Released Temperature
Junction Temperature
125
°C
The above specifications measured at the condition of VOUT
=VADJ.
RECOMMENDED OPERATING CONDITIONS
(ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or surge. And the semiconductor devices may receive serious damage when they continue
to operate over the recommended operating conditions.