
PACKAGE INFORMATION
POWER DISSIPATION (SOT-23-5)
PE-SOT-23-5-0510
This specification is at mounted on board. Power Dissipation (P
D
) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
(Power Dissipation (SOT-23-5) is substitution of SOT-23-6.)
Measurement Conditions
Standard Land Pattern
Environment
Mounting on Board (Wind velocity=0m/s)
Board Material
Glass cloth epoxy plactic (Double sided)
Board Dimensions
40mm
×
40mm
×
1.6mm
Copper Ratio
Top side : Approx. 50% , Back side : Approx. 50%
Through-hole
φ
0.5mm
×
44pcs
Measurement Result
(Topt=25
°
C,Tjmax=125
°
C)
Free Air
250mW
400
°
C/W
Standard Land Pattern
420mW
θ
ja
=
(125
25
°
C)/0.42W
=
263
°
C/W
Power Dissipation
Thermal Resistance
0
50
100
25
75 85
125
150
Ambient Temperature (
°
C)
Power Dissipation
0
200
100
300
400
250
420
500
600
P
D
(
On Board
Free Air
4
40
Measurement Board Pattern
IC Mount Area Unit : mm
RECOMMENDED LAND PATTERN
0.7 MAX.
0.95
0.95
1.9
2.4
1.0
(Unit: mm)