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參數(shù)資料
| 型號： | QPI-1L |
| 廠商： | Vicor Corporation |
| 元件分類： | DC/DC變換器 |
| 英文描述： | 12 Amp Active EMI Filter for 48V DC Bus |
| 中文描述： | 12安培有源EMI濾波器的48V直流總線 |
| 文件頁數(shù)： | 2/8頁 |
| 文件大?。?/td> | 238K |
| 代理商： | QPI-1L |
Picor Corporation www.picorpower.com
QPI-1L Data Sheet Rev. 2.0 Page 2 of 8
Absolute Maximum Ratings
–
Exceeding these parameters may result in permanent damage to the product.
Pins
Parameter
Notes
BUS+ to BUS-
Input voltage
Continuous
BUS+ to BUS-
Input voltage
100ms transient
BUS+/BUS- to Shield Plane
BUS inputs to Shield Hipot
Per test std.
QPI+ to QPI-
Input to output current
Continuous @ 25°C
Package
Power dissipation
V
BUS
= 48 V, I
BUS
= 12 Adc, 25°C
Package
Operating temperature
PCB to QPI Interface
Package
Thermal resistance
Free air
Package
Junction temperature
Internal @ Pdmax and 15°C/W
Package
Thermal resistance
PCB layout
(see Figs. 9 & 10)
1
Package
Storage temperature
Package
Re-flow temperature
20 second exposure @
All Pins
ESD
HBM
Electrical Characteristics
–
Parameter limits apply over the operating temp. range unless otherwise noted.
Min
-0.5
-0.5
Max
80
100
+/-1500
12
4.0
100
50
160
15
125
212
+/-2
Units
Vdc
Vdc
Vdc
Adc
W
°C
°C/W
°C
°C/W
°C
°C
kV
-40
-40
Parameter
BUS+ to BUS- input range
BUS+ to QPI+ voltage drop
BUS- to QPI- voltage drop
Common-mode insertion loss
Differential-mode insertion loss
Input bias current at 80 Volts
Notes
Measured at 10 A
2
Measured at 10 A
2
Measured at 10 A
2
V
BUS
= 48 V frequency = 500 kHz
V
BUS
= 48 V frequency = 500 kHz
Input current from BUS+ to BUS-
Min
30
Typ
Max
80
Units
Vdc
mVdc
mVdc
dB
dB
mA
-300
20
45
85
17
Note 1
-
Refer to Figures 9 & 10 for PCB layout guidelines to achieve this thermal resistance when re-flowed onto the PCB.
Pad Designations
BUS+
BUS-
QPI+
QPI-
SHIELD
THERM 1
THERM 2
12,13,14
1,15,16
7,8,9
2,3,4
5,6
10
11
BUS-
BUS+
QPI+
SHIELD
T
T
7
8
9
11
12
13
16
10
14
15
1
2
3
4
5
6
QPI-
Pad Description
BUS-
Negative bus potential
BUS+
Positive bus voltage
QPI-
Negative input to the converter
QPI+
Positive input to the converter
THERM1
THERM2
Internal connection must be electrically
floating but maximize copper landing
for heat sinking.
Shield
The shield connects to the converter
shield and Y-capacitor common point
through RY.
Note 2
-
Refer to Figure 5 for current derating curve.
QPI-1: (bottom view)
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