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參數(shù)資料
| 型號： | PTN3332 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | High speed differential line receiver |
| 中文描述： | 高速差分線路接收器 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 92K |
| 代理商： | PTN3332 |
Philips Semiconductors
PTN3332
High speed differential line receiver
Product data
Rev. 01 — 07 January 2004
14 of 16
9397 750 08341
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
[9]
15. Revision history
Table 10:
Rev Date
01
Revision history
CPCN
20040107
Description
Product data (9397 750 08341). ECN 853-2443 A14996 dated 15 December 2003.
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| PTN3332D | High speed differential line receiver |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| PTN3332D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:High speed differential line receiver |
| PTN3332D,112 | 功能描述:緩沖器和線路驅(qū)動器 HI SPEED DIFFER LINE RECEIVER RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| PTN3332D,118 | 功能描述:緩沖器和線路驅(qū)動器 HI SPEED DIFFER LINE RECEIVER RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| PTN3332DH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:High speed differential line receiver |
| PTN3332DH,112 | 功能描述:緩沖器和線路驅(qū)動器 HI SPEED DIFFER LINE RECEIVER RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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