參數(shù)資料
        型號(hào): PSD835G1V-70M
        廠商: 意法半導(dǎo)體
        英文描述: Configurable Memory System on a Chip for 8-Bit Microcontrollers
        中文描述: 在8片位微控制器可配置存儲(chǔ)系統(tǒng)
        文件頁(yè)數(shù): 29/110頁(yè)
        文件大?。?/td> 570K
        代理商: PSD835G1V-70M
        PSD8XX Family
        PSD835G2
        28
        The
        PSD835G2
        Functional
        Blocks
        (cont.)
        9.1.2 SRAM
        The SRAM is enabled when RS0
        the SRAM chip select output from the DPLD
        is high.
        RS0 can contain up to three product terms, allowing flexible memory mapping.
        The SRAM can be backed up using an external battery. The external battery should be
        connected to the Vstby pin (PE6). If you have an external battery connected to the
        PSD835G2, the contents of the SRAM will be retained in the event of a power loss. The
        contents of the SRAM will be retained so long as the battery voltage remains at 2V or
        greater. If the supply voltage falls below the battery voltage, an internal power switchover
        to the battery occurs.
        Pin PE7 can be configured as an output that indicates when power is being drawn from the
        external battery. This Vbaton signal will be high with the supply voltage falls below the bat-
        tery voltage and the battery on PE6 is supplying power to the internal SRAM.
        The chip select signal (RS0) for the SRAM, Vstby, and Vbaton are all configured using
        PSDsoft.
        9.1.3 Memory Select Signals
        The main Flash (FSi), secondary Flash (CSBOOTi), and SRAM (RS0) memory select
        signals are all outputs of the DPLD. They are defined using PSDsoft. The following rules
        apply to the equations for the internal chip select signals:
        1. Main Flash memory and secondary Flash memory sector select signals must
        not
        be
        larger than the physical sector size.
        2. Any main Flash memory sector must
        not
        be mapped in the same memory space as
        another Main Flash sector.
        3. A secondary Flash memory sector must
        not
        be mapped in the same memory space as
        another Flash Boot sector.
        4. SRAM and I/O spaces must
        not
        overlap.
        5. A secondary Flash memory sector
        may
        overlap a main Flash memory sector. In case of
        overlap, priority will be given to the Flash Boot sector.
        6. SRAM and I/O spaces
        may
        overlap any other memory sector. Priority will be given to
        the SRAM and I/O.
        Example
        FS0 is valid when the address is in the range of 8000h to BFFFh, CSBOOT0 is valid from
        8000h to 9FFFh, and RS0 is valid from 8000h to 87FFh. Any address in the range of RS0
        will always access the SRAM. Any address in the range of CSBOOT0 greater than 87FFh
        (and less than 9FFFh) will automatically address Boot memory segment 0. Any address
        greater than 9FFFh will access the Flash memory segment 0. You can see that half of the
        Flash memory segment 0 and one-fourth of Boot segment 0 can not be accessed in this
        example. Also note that an equation that defined FS1 to anywhere in the range of 8000h to
        BFFFh would
        not
        be valid.
        Figure 6 shows the priority levels for all memory components. Any component on a higher
        level can overlap and has priority over any component on a lower level. Components on
        the same level must
        not
        overlap. Level one has the highest priority and level 3 has the
        lowest.
        相關(guān)PDF資料
        PDF描述
        PSD835G1V-70MI Configurable Memory System on a Chip for 8-Bit Microcontrollers
        PSD835G1V-70U Configurable Memory System on a Chip for 8-Bit Microcontrollers
        PSD835G1V-70UI Configurable Memory System on a Chip for 8-Bit Microcontrollers
        PSD835G1V-90B81 Configurable Memory System on a Chip for 8-Bit Microcontrollers
        PSD835G1V-90B81I Configurable Memory System on a Chip for 8-Bit Microcontrollers
        相關(guān)代理商/技術(shù)參數(shù)
        參數(shù)描述
        PSD835G2-70U 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 5.0V 4M 70ns RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
        PSD835G2-90U 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 5.0V 4M 90ns RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
        PSD835G2-90UI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 5.0V 4M 90ns RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
        PSD835G2V-12UI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 3.0V 4M 120ns RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
        PSD835G2V-90U 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 3.0V 4M 90ns RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray