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參數(shù)資料
| 型號： | PPC5605BCLU64 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 70/112頁 |
| 文件大小： | 0K |
| 描述： | MCU 32BIT 768K 64MHZ |
| 標準包裝： | 40 |
| 系列： | MPC56xx Qorivva |
| 核心處理器： | e200z0h |
| 芯體尺寸： | 32-位 |
| 速度： | 64MHz |
| 連通性： | CAN，I²C，LIN，SCI，SPI |
| 外圍設備： | POR，PWM，WDT |
| 輸入/輸出數(shù)： | 149 |
| 程序存儲器容量： | 768KB（768K x 8） |
| 程序存儲器類型： | 閃存 |
| EEPROM 大?。?/td> | 4K x 16 |
| RAM 容量： | 64K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 3 V ~ 3.6 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 29x10b，5x12b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 176-LQFP |
| 包裝： | 托盤 |
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MPC5607B Microcontroller Data Sheet, Rev. 7
Electrical characteristics
Freescale Semiconductor
60
IDDSTDBY2 CC P STANDBY2 mode current
9
Slow internal RC
oscillator (128 kHz)
running
TA = 25 °C
—
30
100
A
DTA =55°C
—
75
—
DTA = 85 °C
—
180
700
DTA = 105 °C
—
315
1000
PTA = 125 °C
—
560
1700
IDDSTDBY1 CC T STANDBY1 mode current
10
Slow internal RC
oscillator (128 kHz)
running
TA = 25 °C
—
20
60
A
DTA =55°C
—
45
—
DTA = 85 °C
—
100
350
DTA = 105 °C
—
165
500
DTA = 125 °C
—
280
900
1 V
DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified
2 Running consumption does not include I/Os toggling which is highly dependent on the application. The given value
is thought to be a worst case value with all peripherals running, and code fetched from code flash while modify
operation ongoing on data flash. Notice that this value can be significantly reduced by application: switch off not
used peripherals (default), reduce peripheral frequency through internal prescaler, fetch from RAM most used
functions, use low power mode when possible.
3 Higher current may be sunk by device during power-up and standby exit. Please refer to in-rush average current in
4 RUN current measured with typical application with accesses on both Flash and RAM.
5 Only for the “P” classification: Data and Code Flash in Normal Power. Code fetched from RAM: Serial IPs CAN and
LIN in loop back mode, DSPI as Master, PLL as system clock (4 x Multiplier) peripherals on (eMIOS/CTU/ADC) and
running at max frequency, periodic SW/WDG timer reset enabled.
6 Data Flash Power Down. Code Flash in Low Power. SIRC 128 kHz and FIRC 16 MHz on. 10 MHz XTAL clock.
FlexCAN: instances: 0, 1, 2 ON (clocked but not reception or transmission), instances: 4, 5, 6 clocks gated. LINFlex:
instances: 0, 1, 2 ON (clocked but not reception or transmission), instance: 3 to 9 clocks gated. eMIOS: instance:
0 ON (16 channels on PA[0]–PA[11] and PC[12]–PC[15]) with PWM 20 kHz, instance: 1 clock gated. DSPI:
instance: 0 (clocked but no communication), instance: 1 to 5 clocks gated. RTC/API ON. PIT ON. STM ON. ADC1
OFF. ADC0 ON but no conversion except two analog watchdogs.
7 Only for the “P” classification: No clock, FIRC 16 MHz off, SIRC 128 kHz on, PLL off, HPvreg off,
ULPVreg/LPVreg on. All possible peripherals off and clock gated. Flash in power down mode.
8 When going from RUN to STOP mode and the core consumption is > 6 mA, it is normal operation for the main
regulator module to be kept on by the on-chip current monitoring circuit. This is most likely to occur with junction
temperatures exceeding 125 °C and under these circumstances, it is possible for the current to initially exceed the
maximum STOP specification by up to 2 mA. After entering stop, the application junction temperature will reduce
to the ambient level and the main regulator will be automatically switched off when the load current is below 6 mA.
9 Only for the “P” classification: ULPreg on, HP/LPVreg off, 32 KB RAM on, device configured for minimum
consumption, all possible modules switched off.
10 ULPreg on, HP/LPVreg off, 8 KB RAM on, device configured for minimum consumption, all possible modules
switched off.
Table 27. Power consumption on VDD_BV and VDD_HV (continued)
Symbol
C
Parameter
Conditions1
Value
Unit
Min
Typ
Max
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