參數(shù)資料
型號(hào)： PNX2000
廠商： NXP Semiconductors N.V.
英文描述： Audio video input processor
中文描述： 音頻視頻輸入處理器
文件頁(yè)數(shù)： 27/31頁(yè)
文件大?。?/td> 244K
代理商： PNX2000
9397 750 13928
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 03 – 23 August 2004
27 of 31
Philips Semiconductors
PNX2000
Audio video input processor
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering can still be
used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these
situations reflow soldering is recommended. In these situations reflow soldering is
recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270
°
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 220
°
C (SnPb process) or below 245
°
C (Pb-free process)
—
for all BGA and SSOP-T packages
—
for packages with a thickness
≥
2.5 mm
—
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 235
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
相關(guān)PDF資料
PDF描述
PNX2000HL Audio video input processor
PNX3000 Analog front end for digital video processors
PNX3000HL Analog front end for digital video processors
PNX3000N3 Analog front end for digital video processors
PNX8510 Analog companion chip
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PNX2000HL 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Audio video input processor
PNX3000 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Analog front end for digital video processors
PNX3000HL 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Analog front end for digital video processors
PNX3000HL/N3 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Analog front end for digital video processors
PNX3000N3 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Analog front end for digital video processors
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