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參數(shù)資料
| 型號： | PMM8218TSR |
| 廠商： | ERICSSON POWER MODULES AB |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 50 W DC-DC REG PWR SUPPLY MODULE |
| 封裝： | ROHS COMPLIANT PACKAGE-20 |
| 文件頁數(shù)： | 26/34頁 |
| 文件大?。?/td> | 1801K |
| 代理商： | PMM8218TSR |
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Ericsson Internal
PRODUCT SPECIFICATION
3 (6)
Prepared (also subject responsible if other)
No.
SEC/D EPANHON
4/1301-BMR 651
Approved
Checked
Date
Rev
Reference
SEC/D (Linda Zhong)
See end
2006-3-17
B
Soldering Information - Surface mounting
The surface mount version of product is intended for
convection or vapor phase reflow Pb-free processes. To
achieve a good and reliable soldering result, make sure to
follow the recommendations from the solder paste supplier,
to use state-of-the-art reflow equipment and reflow profiling
techniques as well as the following guidelines.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside of the DC/DC regulator. The
cleaning residues may affect long time reliability and isolation
voltage.
Minimum pin temperature recommendations
Pin number 12 is recommended as reference location for the
minimum pin temperature recommendations since this will be
the coolest solder joint during the reflow process.
SnPb solder processes
For Pb solder processes, a pin temperature (T
PIN) in excess of
the solder melting temperature, (T
L, +183 °C for Sn63/Pb37)
for more than 30 seconds, and a peak temperature of
+210 °C is recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
PIN) in
excess of the solder melting temperature (T
L, +217 to +221 °C
for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a
peak temperature of +235 °C on all solder joints is
recommended to ensure a reliable solder joint.
Maximum regulator temperature requirements
To avoid damage or performance degradation of the product,
the reflow profile should be optimized to avoid excessive
heating. The maximum product temperature shall be
monitored by attaching a thermal coupler to the top of the
main transformer.
A sufficiently extended preheat time is recommended to
ensure an even temperature across the host PCB, for both
small and large devices. To reduce the risk of excessive
heating is also recommended to reduce the time in the reflow
zone as much as possible.
SnPb solder processes
For conventional SnPb solder processes, the product is
qualified for MSL 1 according to IPC/JEDEC standard
J-STD-020C.
During reflow, T
P must not exceed +225 °C at any time.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, T
P must not exceed +260 °C at any time.
25 °C
Time
Temperature
Ramp-down
(cooling)
Ramp-up
Reflow
Preheat
Time 25 °C to peak
T
P
T
L
Profile features
Sn/Pb eutectic
assembly
Pb-free assembly
Average ramp-up rate
3 °C/s max
Solder melting
temperature (typical)
T
L
+183 °C
+221 °C
Peak converter
temperature
T
P
+225 °C
+260 °C
Average ramp-down rate
6 °C/s max
Time 25 °C to peak
temperature
6 minutes max
8 minutes max
PIN 12 for measurement of
minimum solder joint
temperature, TPIN
Main transformer for
measurement of Max
product temperature, TP
E
PMM 8000 series
POL regulator, Input 8-14 V, Output 50 A/275 W
EN/LZT 146 339 R1A April 2006
Ericsson Power Modules AB
Technical Specication
E
PMM 8000 series
POL regulator, Input 8-14 V, Output 50 A/275 W
EN/LZT 146 339 R1A April 2006
Ericsson Power Modules AB
Technical Specication
E
PMM 8000 series
POL regulator, Input 8-14 V, Output 50 A/275 W
EN/LZT 146 339 R1A April 2006
Ericsson Power Modules AB
Technical Specication
32
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