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參數(shù)資料
| 型號： | PLQ08 |
| 廠商： | 意法半導體 |
| 英文描述： | CONNECTOR |
| 中文描述： | 連接器 |
| 文件頁數(shù)： | 5/5頁 |
| 文件大?。?/td> | 111K |
| 代理商： | PLQ08 |
F 126 (Plastic)
PACKAGE MECHANICAL DATA
Cooling method: by convection (method A)
Marking: type number
Weight: 0.4g
note 2
B
A
B
C
note 1
note 1
D
D
O
/
O
/
O
/
E
E
REF.
DIMENSIONS
NOTES
Millimeters
Min.
6.05
Inches
Min.
0.238
Max.
6.35
Max.
0.250
A
1 - The lead diameter
D is not controlled over zone E
2 - The minimum axial lengh within which the device may be
placed with its leads bent at right angles is 0.59"(15 mm)
B
26
1.024
C
D
2.95
0.76
3.05
0.86
0.116
0.029
0.120
0.034
E
1.27
0.050
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
1994 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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5/5
PLQ 08/PLQ 1
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