參數(shù)資料
型號(hào): PIP201-12M-3,518
廠商: NXP SEMICONDUCTORS
元件分類: 穩(wěn)壓器
英文描述: 200 A SWITCHING REGULATOR, PQCC68
封裝: 10 X 10 MM, 0.85 MM HEIGHT, PLASTIC, SOT-687-1, HVQFN-68
文件頁數(shù): 13/20頁
文件大小: 345K
代理商: PIP201-12M-3,518
Koninklijke Philips Electronics N.V. 2003.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 19 November 2003
Document order number: 9397 750 11942
Contents
Philips Semiconductors
PIP201-12M-3
DC-to-DC converter powertrain
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Basic functionality . . . . . . . . . . . . . . . . . . . . . . . 3
MOSFET driver function . . . . . . . . . . . . . . . . . . 4
Bootstrap diode. . . . . . . . . . . . . . . . . . . . . . . . . 4
3-state function . . . . . . . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal characteristics. . . . . . . . . . . . . . . . . . . 6
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application information. . . . . . . . . . . . . . . . . . . 9
Typical application . . . . . . . . . . . . . . . . . . . . . . 9
Switching frequency . . . . . . . . . . . . . . . . . . . . 11
Thermal design . . . . . . . . . . . . . . . . . . . . . . . . 11
Test information. . . . . . . . . . . . . . . . . . . . . . . . 12
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Rework guidelines . . . . . . . . . . . . . . . . . . . . . 16
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PCB design guidelines . . . . . . . . . . . . . . . . . . 16
Solder paste printing. . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
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