參數(shù)資料
型號： EPF10K130EBC356-1
廠商： Altera
文件頁數(shù)： 95/100頁
文件大?。?/td> 0K
描述： IC FLEX 10KE FPGA 130K 356 BGA
產品培訓模塊： Three Reasons to Use FPGA's in Industrial Designs
標準包裝： 48
系列： FLEX-10KE®
LAB/CLB數(shù)： 832
邏輯元件/單元數(shù)： 6656
RAM 位總計： 65536
輸入/輸出數(shù)： 274
門數(shù)： 342000
電源電壓： 2.375 V ~ 2.625 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 356-BGA
供應商設備封裝： 356-BGA（35x35）
94
Altera Corporation
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Power
Consumption
The supply power (P) for FLEX 10KE devices can be calculated with the
following equation:
P = PINT + PIO = (ICCSTANDBY + ICCACTIVE) × VCC + PIO
The ICCACTIVE value depends on the switching frequency and the
application logic. This value is calculated based on the amount of current
that each LE typically consumes. The PIO value, which depends on the
device output load characteristics and switching frequency, can be
calculated using the guidelines given in Application Note 74 (Evaluating
Compared to the rest of the device, the embedded array consumes a
negligible amount of power. Therefore, the embedded array can be
ignored when calculating supply current.
The ICCACTIVE value can be calculated with the following equation:
ICCACTIVE = K × fMAX × N × togLC ×
Where:
fMAX
=
Maximum operating frequency in MHz
N
=
Total number of LEs used in the device
togLC
=
Average percent of LEs toggling at each clock
(typically 12.5%)
K=
Constant
Table 80 provides the constant (K) values for FLEX 10KE devices.
This calculation provides an ICC estimate based on typical conditions with
no output load. The actual ICC should be verified during operation
because this measurement is sensitive to the actual pattern in the device
and the environmental operating conditions.
Table 80. FLEX 10KE K Constant Values
Device
K Value
EPF10K30E
4.5
EPF10K50E
4.8
EPF10K50S
4.5
EPF10K100E
4.5
EPF10K130E
4.6
EPF10K200E
4.8
EPF10K200S
4.6
A
MHz
LE
×
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相關代理商/技術參數(shù)
參數(shù)描述
EPF10K130EBC356-1X 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EBC356-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EBC356-2X 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EBC356-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EBC600-1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 424 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
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