參數(shù)資料
型號(hào)： PIC24FV16KA301-I/SS
廠商： Microchip Technology
文件頁(yè)數(shù)： 30/352頁(yè)
文件大小： 0K
描述： MCU 16KB FLASH 2KB RAM 20-SSOP
標(biāo)準(zhǔn)包裝： 67
系列： PIC® XLP™ 24F
核心處理器： PIC
芯體尺寸： 16-位
速度： 32MHz
連通性： I²C，IrDA，LIN，SPI，UART/USART
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，HLVD，POR，PWM，WDT
輸入/輸出數(shù)： 17
程序存儲(chǔ)器容量： 16KB（5.5K x 24）
程序存儲(chǔ)器類型： 閃存
EEPROM 大?。?/td> 512 x 8
RAM 容量： 2K x 8
電壓 - 電源 (Vcc/Vdd)： 2 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 12x12b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 20-SSOP（0.209"，5.30mm 寬）
包裝： 管件
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2011-2012 Microchip Technology Inc.
DS39995C-page 125
PIC24FV32KA304 FAMILY
10.2.4.2
Exiting Deep Sleep Mode
Deep Sleep mode exits on any one of the following events:
A POR event on VDD supply. If there is no
DSBOR circuit to re-arm the VDD supply POR cir-
cuit, the external VDD supply must be lowered to
the natural arming voltage of the POR circuit.
A DSWDT time-out. When the DSWDT timer
times out, the device exits Deep Sleep.
An ARTCC alarm (if RTCEN = 1).
An assertion (‘0’) of the MCLR pin.
An assertion of the INT0 pin (if the interrupt was
enabled before Deep Sleep mode was entered).
The polarity configuration is used to determine the
assertion level (‘0’ or ‘1’) of the pin that will cause
an exit from Deep Sleep mode. Exiting from Deep
Sleep mode requires a change on the INT0 pin
while in Deep Sleep mode.
Exiting Deep Sleep mode generally does not retain the
state of the device and is equivalent to a Power-on
Reset (POR) of the device. Exceptions to this include
the RTCC (if present), which remains operational
through the wake-up, the DSGPRx registers and
DSWDT.
Wake-up events that occur after Deep Sleep exits, but
before the POR sequence completes, are ignored and
are not be captured in the DSWAKE register.
The sequence for exiting Deep Sleep mode is:
1.
After a wake-up event, the device exits Deep
Sleep and performs a POR. The DSEN bit is
cleared automatically. Code execution resumes
at the Reset vector.
2.
To determine if the device exited Deep Sleep,
read the Deep Sleep bit, DPSLP (RCON<10>).
This bit will be set if there was an exit from Deep
Sleep mode; if the bit is set, clear it.
3.
Determine the wake-up source by reading the
DSWAKE register.
4.
Determine if a DSBOR event occurred during
Deep Sleep mode by reading the DSBOR bit
(DSCON<1>).
5.
If application context data has been saved, read
it back from the DSGPR0 and DSGPR1 registers.
6.
Clear the RELEASE bit (DSCON<0>).
10.2.4.3
Saving Context Data with the
DSGPR0/DSGPR1 Registers
As exiting Deep Sleep mode causes a POR, most
Special Function Registers reset to their default POR
values. In addition, because VCORE power is not sup-
plied in Deep Sleep mode, information in data RAM
may be lost when exiting this mode.
Applications which require critical data to be saved
prior to Deep Sleep may use the Deep Sleep General
Purpose registers, DSGPR0 and DSGPR1 or data
EEPROM (if available). Unlike other SFRs, the
contents of these registers are preserved while the
device is in Deep Sleep mode. After exiting Deep
Sleep, software can restore the data by reading the
registers and clearing the RELEASE bit (DSCON<0>).
10.2.4.4
I/O Pins During Deep Sleep
During Deep Sleep, the general purpose I/O pins retain
their previous states and the Secondary Oscillator
(SOSC) will remain running, if enabled. Pins that are
configured as inputs (TRISx bit is set), prior to entry into
Deep Sleep, remain high-impedance during Deep
Sleep. Pins that are configured as outputs (TRISx bit is
clear), prior to entry into Deep Sleep, remain as output
pins during Deep Sleep. While in this mode, they
continue to drive the output level determined by their
corresponding LATx bit at the time of entry into Deep
Sleep.
Once the device wakes back up, all I/O pins continue to
maintain their previous states, even after the device
has finished the POR sequence and is executing
application code again. Pins configured as inputs
during Deep Sleep remain high-impedance and pins
configured as outputs continue to drive their previous
value. After waking up, the TRIS and LAT registers,
and the SOSCEN bit (OSCCON<1>) are reset. If
firmware modifies any of these bits or registers, the I/O
will not immediately go to the newly configured states.
Once the firmware clears the RELEASE
bit
(DSCON<0>), the I/O pins are “released”. This causes
the I/O pins to take the states configured by their
respective TRISx and LATx bit values.
This means that keeping the SOSC running after
waking up requires the SOSCEN bit to be set before
clearing RELEASE.
If the Deep Sleep BOR (DSBOR) is enabled, and a
DSBOR or a true POR event occurs during Deep
Sleep, the I/O pins will be immediately released, similar
to clearing the RELEASE bit. All previous state
information will be lost, including the general purpose
DSGPR0 and DSGPR1 contents.
If a MCLR Reset event occurs during Deep Sleep, the
DSGPRx, DSCON and DSWAKE registers will remain
valid, and the RELEASE bit will remain set. The state
of the SOSC will also be retained. The I/O pins,
however, will be reset to their MCLR Reset state. Since
RELEASE is still set, changes to the SOSCEN bit
(OSCCON<1>) cannot take effect until the RELEASE
bit is cleared.
In all other Deep Sleep wake-up cases, application
firmware must clear the RELEASE bit in order to
reconfigure the I/O pins.
Note:
Any interrupt pending when entering
Deep Sleep mode is cleared.
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PIC24FV16KA301T-I/SO 功能描述:16位微控制器 - MCU 16KB 2KBRM 512B EE 16Mp 12b ADC CTMU 5V RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
PIC24FV16KA301T-I/SS 功能描述:16位微控制器 - MCU 16KB 2KBRM 512B EE 16Mp 12b ADC CTMU 5V RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
PIC24FV16KA302 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:20/28/44/48-Pin, General Purpose, 16-Bit Flash Microcontrollers with XLP Technology
PIC24FV16KA302-E/ML 功能描述:16位微控制器 - MCU 16KB 2KBRM 512B EE 16Mp 12b ADC CTMU 5V RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
PIC24FV16KA302-E/SO 功能描述:16位微控制器 - MCU 16KB 2KBRM 512B EE 16Mp 12b ADC CTMU 5V RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
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