IWDT
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉锛� PIC18F1330T-I/ML
寤犲晢锛� Microchip Technology
鏂囦欢闋佹暩(sh霉)锛� 199/318闋�
鏂囦欢澶у皬锛� 0K
鎻忚堪锛� IC PIC MCU FLASH 4KX16 28QFN
鐢�(ch菐n)鍝佸煿瑷�(x霉n)妯″锛� Asynchronous Stimulus
妯�(bi膩o)婧�(zh菙n)鍖呰锛� 1,600
绯诲垪锛� PIC® 18F
鏍稿績铏曠悊鍣細 PIC
鑺珨灏哄锛� 8-浣�
閫熷害锛� 40MHz
閫i€氭€э細 UART/USART
澶栧湇瑷�(sh猫)鍌欙細 娆犲妾㈡脯/寰�(f霉)浣�锛孡VD锛孭OR锛孭WM锛學DT
杓稿叆/杓稿嚭鏁�(sh霉)锛� 16
绋嬪簭瀛樺劜鍣ㄥ閲忥細 8KB锛�4K x 16锛�
绋嬪簭瀛樺劜鍣ㄩ鍨嬶細 闁冨瓨
EEPROM 澶�?銆�?/td> 128 x 8
RAM 瀹归噺锛� 256 x 8
闆诲 - 闆绘簮 (Vcc/Vdd)锛� 4.2 V ~ 5.5 V
鏁�(sh霉)鎿�(j霉)杞�(zhu菐n)鎻涘櫒锛� A/D 4x10b
鎸暕鍣ㄥ瀷锛� 鍏�(n猫i)閮�
宸ヤ綔婧害锛� -40°C ~ 85°C
灏佽/澶栨锛� 28-VQFN 瑁搁湶鐒婄洡
鍖呰锛� 甯跺嵎 (TR)
鍏跺畠鍚嶇ū锛� PIC18F1330T-I/MLTR
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PIC18F1230/1330
DS39758D-page 278
2009 Microchip Technology Inc.
Module Differential Currents (
IWDT, IBOR, ILVD, IOSCB, IAD)
D026
(
IAD)
A/D Converter
1.0
1.6
A
-40掳C to +85掳C
VDD = 2.0V
A/D on, not converting
1.0
1.6
A
-40掳C to +85掳C
VDD = 3.0V
1.0
1.6
A
-40掳C to +85掳C
VDD = 5.0V
2.0
7.6
A
-40掳C to +125掳C
23.2
DC Characteristics:
Power-Down and Supply Current
PIC18F1230/1330 (Industrial)
PIC18LF1230/1330 (Industrial) (Continued)
PIC18LF1230/1330
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40掳C
TA +85掳C for industrial
PIC18F1230/1330
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40掳C
TA +85掳C for industrial
-40掳C
TA +125掳C for extended
Param
No.
Device
Typ
Max
Units
Conditions
Note 1:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that
add delta current disabled (such as WDT, Timer1 oscillator, BOR, etc.).
2:
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
MCLR = VDD; WDT enabled/disabled as specified.
3:
Low-power Timer1 oscillator selected.
4:
BOR and LVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.
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