參數(shù)資料
型號(hào)： PIC16LF1823-I/ML
廠商： Microchip Technology
文件頁數(shù)： 102/109頁
文件大?。?/td> 0K
描述： IC MCU 8BIT FLASH 16QFN
產(chǎn)品培訓(xùn)模塊： 8-bit PIC® Microcontroller Portfolio
標(biāo)準(zhǔn)包裝： 91
系列： PIC® XLP™ 16F
核心處理器： PIC
芯體尺寸： 8-位
速度： 32MHz
連通性： I²C，LIN，SPI，UART/USART
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，POR，PWM，WDT
輸入/輸出數(shù)： 12
程序存儲(chǔ)器容量： 3.5KB（2K x 14）
程序存儲(chǔ)器類型： 閃存
EEPROM 大?。?/td> 256 x 8
RAM 容量： 128 x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x10b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 16-VQFN 裸露焊盤
包裝： 管件
Philips Semiconductors
SC16C554/554D
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
Product data
Rev. 05 — 10 May 2004
52 of 55
9397 750 13132
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reow
soldering with peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow
oven. The package body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex
foil by using a hot bar soldering process. The appropriate soldering prole can be provided on
request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PIC16LF1823T/CS 制造商:Microchip Technology Inc 功能描述:IC MCU 8BIT 3.5KB FLASH
PIC16LF1823T-E/SL 制造商:Microchip Technology Inc 功能描述:3.5 KB FLASH, 128 BYTES RAM, 3 - Tape and Reel
PIC16LF1823T-I/ML 功能描述:8位微控制器 -MCU 3.5KB 128B RAM 32MHz Int. Osc 12 I/0 RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1823T-I/SL 功能描述:8位微控制器 -MCU 3.5KB 128B RAM 32MHz Int. Osc 12 I/0 RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1823T-I/ST 功能描述:8位微控制器 -MCU 3.5KB 128B RAM 32MHz Int. Osc 12 I/0 RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
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