參數(shù)資料
型號(hào): PIC16LC556-04/SS
元件分類: 微控制器/微處理器
英文描述: 8-BIT, OTPROM, 4 MHz, RISC MICROCONTROLLER, PDSO20
封裝: 0.209 INCH, PLASTIC, SSOP-20
文件頁(yè)數(shù): 80/104頁(yè)
文件大?。?/td> 697K
代理商: PIC16LC556-04/SS
1996 Microchip Technology Inc.
Preliminary
DS40143A-page 77
PIC16C55X
11.0
PACKAGING INFORMATION
Ceramic CERDIP Dual In-Line Family
Notes:
1.
Controlling parameter: inches.
2.
Parameter “e1” (“e”) is non-cumulative.
3.
Seating plane (standoff) is dened by board hole size.
4.
Parameter “B1” is nominal.
Symbol List for Ceramic CERDIP Dual In-Line Package Parameters
Symbol
Description of Parameters
α
Angular spacing between min. and max. lead positions measured at the gauge plane
A
Distance between seating plane to highest point of body (lid)
A1
Distance between seating plane and base plane
A2
Distance from base plane to highest point of body (lid)
A3
Base body thickness
B
Width of terminal leads
B1
Width of terminal lead shoulder which locate seating plane (standoff geometry optional)
C
Thickness of terminal leads
D
Largest overall package parameter of length
D1
Body width parameters not including leads
E
Largest overall package width parameter outside of lead
E1
Body width parameter - end lead center to end lead center
eA
Linear spacing of true minimum lead position center line to center line
eB
Linear spacing between true lead position outside of lead to outside of lead
e1
Linear spacing between center lines of body standoffs (terminal leads)
L
Distance from seating plane to end of lead
N
Total number of potentially usable lead positions
S
Distance from true position center line of Number 1 lead to the extremity of the body
S1
Distance from other end lead edge positions to the extremity of the body
This document was created with FrameMaker404
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