參數(shù)資料
型號: PIC16F636-I/ST
廠商: Microchip Technology
文件頁數(shù): 34/74頁
文件大?。?/td> 0K
描述: IC MCU FLASH 2KX14 14TSSOP
產(chǎn)品培訓(xùn)模塊: Asynchronous Stimulus
8-bit PIC® Microcontroller Portfolio
標(biāo)準(zhǔn)包裝: 96
系列: PIC® 16F
核心處理器: PIC
芯體尺寸: 8-位
速度: 20MHz
外圍設(shè)備: 欠壓檢測/復(fù)位,LVD,POR,WDT
輸入/輸出數(shù): 11
程序存儲器容量: 3.5KB(2K x 14)
程序存儲器類型: 閃存
RAM 容量: 128 x 8
電壓 - 電源 (Vcc/Vdd): 2 V ~ 5.5 V
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
包裝: 管件
產(chǎn)品目錄頁面: 638 (CN2011-ZH PDF)
配用: AC162057-ND - MPLAB ICD 2 HEADER 14DIP
Micrel, Inc.
KSZ8841-PMQL
October 2007
4
M9999-100407-1.5
Contents
Pin Configuration .............................................................................................................................................................. 8
Pin Description .................................................................................................................................................................. 9
Functional Description ................................................................................................................................................... 14
PCI Bus Interface Unit .................................................................................................................................................. 14
PCI Bus Interface ................................................................................................................................................. 14
TXDMA Logic and TX Buffer Manager ................................................................................................................ 14
RXDMA Logic and RX Buffer Manager................................................................................................................ 14
Power Management...................................................................................................................................................... 14
Power down.......................................................................................................................................................... 14
Wake-on-LAN....................................................................................................................................................... 14
Link Change ......................................................................................................................................................... 15
Wake-up Packet ................................................................................................................................................... 15
Magic Packet........................................................................................................................................................ 15
Physical Layer Transceiver (PHY) ................................................................................................................................. 16
100BASE-TX Transmit.................................................................................................................................................. 16
100BASE-TX Receive................................................................................................................................................... 16
PLL Clock Synthesizer (Recovery) ............................................................................................................................... 16
Scrambler/De-scrambler (100BASE-TX Only).............................................................................................................. 16
10BASE-T Transmit ...................................................................................................................................................... 16
10BASE-T Receive ....................................................................................................................................................... 16
MDI/MDI-X Auto Crossover .......................................................................................................................................... 17
Straight Cable....................................................................................................................................................... 17
Crossover Cable................................................................................................................................................... 18
Auto Negotiation ........................................................................................................................................................... 18
LinkMD Cable Diagnostics ............................................................................................................................................. 20
Access........................................................................................................................................................................... 20
Usage............................................................................................................................................................................ 20
Media Access Control (MAC) and other........................................................................................................................ 20
Inter Packet Gap (IPG) ................................................................................................................................................. 20
Back-Off Algorithm........................................................................................................................................................ 20
Late Collision ................................................................................................................................................................ 20
Flow Control.................................................................................................................................................................. 20
Half-Duplex Backpressure ............................................................................................................................................ 21
Clock Generator............................................................................................................................................................ 21
EEPROM Interface ....................................................................................................................................................... 21
Loopback Support......................................................................................................................................................... 23
Host Communication ...................................................................................................................................................... 24
Host Communication Descriptor Lists and Data Buffers .............................................................................................. 24
Receive Descriptors (RDES0-RDES3) ......................................................................................................................... 24
Transmit Descriptors (TDES0-TDES3)......................................................................................................................... 26
PCI Configuration Registers .......................................................................................................................................... 28
Configuration ID Register (CFID Offset 00H) ............................................................................................................... 29
Command and Status Configuration Register (CFCS Offset 04H)............................................................................... 29
Configuration Revision Register (CFRV Offset 08H).................................................................................................... 31
Configuration Latency Timer Register (CFLT Offset 0CH)........................................................................................... 31
Configuration Base Memory Address Register (CBMA Offset 10H) ............................................................................ 31
Subsystem ID Register (CSID Offset 2CH) .................................................................................................................. 32
Capabilities Pointer Register (CCAP Offset 34H)......................................................................................................... 32
Configuration Interrupt Register (CFIT Offset 3CH) ..................................................................................................... 32
Capabilities ID Register (CCID Offset 50H).................................................................................................................. 33
Power-Management Control and Status Register (CPMC Offset 54H)........................................................................ 35
PCI Control & Status Registers ..................................................................................................................................... 36
MAC DMA Transmit Control Register (MDTXC Offset 0x0000) ................................................................................... 36
MAC DMA Receive Control Register (MDRXC Offset 0x0004).................................................................................... 37
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PIC16F636T-I/SL 功能描述:8位微控制器 -MCU 4kb 128 RAM 12 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F636T-I/ST 功能描述:8位微控制器 -MCU 4kb 128 RAM 12 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F639-E/P 功能描述:8位微控制器 -MCU 4kb 128 RAM 12 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
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