參數(shù)資料
型號(hào): PIC16C67
英文描述: PIC16C67 Rev A Silicon Errata
中文描述: PIC16C67版本A芯片勘誤表
文件頁數(shù): 26/67頁
文件大?。?/td> 2723K
代理商: PIC16C67
Rev. 2.0, 03/06/02, 23
2.5
Build Configurations
The HEW allows you to store all of your build options into a build configuration (figure 2.14). This means that
you can “freeze” all of the options and give them a name. Later on, you can select that configuration and all of
the options for all of the build phases will be restored. These build configurations also allow the user to specify
debugger settings for a build configuration. This means that each configuration can be targeted at a different end
platform. (See chapter 7, “Debugging your HEW project”, in the Hitachi Embedded Workshop 2.1 HEW
Debugger User’s Manual, for further information).
Figure 2.14 shows three build configurations; “Default”, “MyDebug” and “MyOptimized”. In the first
configuration, “Default”, each of the phases (compile and assemble) are set to their standard settings. In the
second configuration, “MyDebug”, each of the files are being built with debug information switched on. In the
third configuration, “MyOptimized”, each of the files are being built with optimization on full and without any
debug information. The developer of this project can select any of those configurations and build them without
having to return to the options dialogs to set them again.
C
Source Files
Assembler
Source Files
C:\MyProject\Default
"Default"
Configuration
C:\MyProject\MyDebug
"MyDebug"
Configuration
C:\MyProject\MyOptimized
"MyOptimized"
Configuration
Debug:
ON
Optimize: OFF
List File:
YES
Debug:
ON
Optimize: OFF
List File:
NO
Debug:
OFF
Optimize: ON
List File:
NO
Debug:
OFF
Optimize: ON
List File:
NO
Debug:
OFF
Optimize: OFF
List File:
YES
Debug:
ON
Optimize: OFF
List File:
NO
Figure 2.14: Configurations and File Options
相關(guān)PDF資料
PDF描述
PIC16C64X_66X
PIC16C62B Complete Mid-Range Reference Manual
PIC16LC74B PIC16LC74B-16/PTL16 Datasheet
PIC16F688 Tips 'n Tricks
PIC16F83A-10/P 8-BIT, FLASH, 10 MHz, RISC MICROCONTROLLER, PDIP18
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PIC16C67/JW 功能描述:8位微控制器 -MCU 14KB 368 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16C67-04/L 功能描述:8位微控制器 -MCU 14KB 368 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16C67-04/L 制造商:Microchip Technology Inc 功能描述:8BIT CMOS MCU SMD 16C67 PLCC44
PIC16C67-04/P 功能描述:8位微控制器 -MCU 14KB 368 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16C67-04/P 制造商:Microchip Technology Inc 功能描述:IC 8BIT CMOS MCU 16C67 DIP40