參數(shù)資料
型號(hào): PIC12LC672T-04I/MF
廠商: Microchip Technology
文件頁數(shù): 118/129頁
文件大?。?/td> 0K
描述: IC MCU OTP 2KX14 LV W/AD 8-DFN
標(biāo)準(zhǔn)包裝: 3,300
系列: PIC® 12C
核心處理器: PIC
芯體尺寸: 8-位
速度: 4MHz
外圍設(shè)備: POR,WDT
輸入/輸出數(shù): 5
程序存儲(chǔ)器容量: 3.5KB(2K x 14)
程序存儲(chǔ)器類型: OTP
RAM 容量: 128 x 8
電壓 - 電源 (Vcc/Vdd): 2.5 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 4x8b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 8-VDFN 裸露焊盤
包裝: 帶卷 (TR)
其它名稱: PIC12LC672T04I/MF
1999 Microchip Technology Inc.
DS30561B-page 89
PIC12C67X
12.0
ELECTRICAL SPECIFICATIONS FOR PIC12C67X
Absolute Maximum Ratings
Ambient temperature under bias...............................................................................................................–40° to +125°C
Storage temperature ............................................................................................................................. –65°C to +150°C
Voltage on any pin with respect to VSS (except VDD and MCLR)................................................... –0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ................................................................................................................ 0 to +7.0V
Voltage on MCLR with respect to VSS (Note 2)..................................................................................................0 to +14V
Total power dissipation (Note 1) ........................................................................................................................... 700 mW
Maximum current out of VSS pin ........................................................................................................................... 200 mA
Maximum current into VDD pin .............................................................................................................................. 150 mA
Input clamp current, IIK (VI < 0 or VI > VDD)
..................................................................................................................... ± 20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)
............................................................................................................. ± 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin .................................................................................................... 25 mA
Maximum current sunk by GPIO pins combined ...................................................................................................100 mA
Maximum current sourced by GPIO pins combined.............................................................................................. 100 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD -
∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOl x IOL).
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
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