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參數資料
| 型號： | PGB2010402KRHF |
| 元件分類： | TVS二極管 - 瞬態(tài)電壓抑制 |
| 英文描述： | BIDIRECTIONAL, SILICON, TVS DIODE |
| 封裝： | HALOGEN FREE AND ROHS COMPLIANT, ULTRA SMALL, PLASTIC PACKAGE-2 |
| 文件頁數： | 3/5頁 |
| 文件大?。?/td> | 218K |
| 代理商： | PGB2010402KRHF |
www.littelfuse.com
2011 Littelfuse
PGB2 Series
Specications are subject to change without notice.
3
Revised: January 4, 2011
PulseGuard Suppressors
Surface Mount Polymeric ESD Suppressors
Environmental Specications
Operating Temperature
-65°C to +125°C
Biased Humity:
Biased Heat:
40°C, 95% RH, 1000 hours
85°C, 1000 hours
Thermal Shock
MIL-STD-202, Method 107G,
-65°C to 125°C, 30 min. cycle,
10 cycles
Vibration
MIL-STD-202, Method 201A
Chemical Resistance
MIL-STD-202, Method 215
Solder Leach Resistance and
Terminal Adhesion
Physical Specications
Materials
Device Weight
0.349 mg
Solderability
MIL-STD-202, Method 208
Soldering
Parameters
Design Consideration
Because of the fast rise-time of the ESD transient, proper
consideration to achieving optimal ESD suppression. The
devices should be placed on the circuit board as close to the
source of the ESD transient as possible. Install PulseGuard
directly behind the connector so that they are the rst board-
level circuit component encountered by the ESD transient.
Soldering Parameters
Reow Condition
Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min))
150°C
- Temperature Max (T
s(max))
200°C
- Time (min to max) (t
s)
60 – 180 seconds
Average ramp up rate (Liquidus Temp
(T
L) to peak
T
S(max) to TL - Ramp-up Rate
Reow
- Temperature (T
L) (Liquidus)
217°C
- Temperature (t
L)
60 – 150 seconds
Peak Temperature (T
P)
260°C
Time within 5°C of actual peak
Temperature (t
p)
10 – 30 seconds
Ramp-down Rate
Time 25°C to peak Temperature (T
P)
Notes:
- PGB2 Series recommended for reow soldering only
- For recommended soldering pad layout dimensions,
please refer to Dimensions section of this data sheet
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