參數(shù)資料
型號(hào): PG0063.334T
英文描述: SMT Power Inductors - Unshielded Drum Core - PG0063 series - (9/02)
中文描述: SMT功率電感器-非屏蔽鼓核心- PG0063系列- (9 / 02)
文件頁數(shù): 2/2頁
文件大?。?/td> 87K
代理商: PG0063.334T
PRELIMINARY P568.P (9/02)
For More Information :
Printed on recycled paper. 2002, Pulse Engineering, Inc.
UNITED STATES
(Worldwide)
12220 World Trade Drive
San Diego, CA 92128
U.S.A.
http://www.pulseeng.com
TEL: 858 674 8100
FAX: 858 674 8262
Performance warranty of products offered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product
names mentioned herein may be trademarks or registered trademarks of their respective owners.
UNITED KINGDOM
(Northern Europe)
1 & 2 Huxley Road
The Surrey Research Park
Guildford, Surrey GU2 5RE
United Kingdom
TEL: 44 1483 401700
FAX: 44 1483 401701
FRANCE
(Southern Europe)
Zone Industrielle
F-39270
Orgelet
France
TEL: 33 3 84 35 04 04
FAX: 33 3 84 25 46 41
TAIWAN, R.O.C.
(Northern Asia)
3F-4, No. 81, Sec. 1
HsinTai Wu Road
Hsi-Chih, Taipei Hsien
Taiwan, R.O.C.
Tel: 886 2 2698 0228
FAX: 886 2 2698 0948
SINGAPORE
(Southern Asia)
150 Kampong Ampat
#07-01/02
KA Centre
Singapore 368324
TEL: 65 287 8998
FAX: 65 280 0080
HONG KONG
(China/Hong Kong)
19/F, China United Plaza
1008 Tai Nan West Street
Cheung Sha Wan, Kowloon
Hong Kong, China
TEL: 852 2788 6588
FAX: 852 2776 1055
DISTRIBUTOR
SMT POWER INDUCTORS
Unshielded Drum Core - PG0063 Series
Notes from Tables
1. Inductance at Irated is a typical inductance value for the
component taken at rated current.
2. The rated current listed is the lower of the saturation current
@ 25°C or the heating current.
3. The saturation current, Isat, is the current at which the
component inductance drops by 10% (typical) at an ambient
temperature of 25°C. This current is determined by placing the
component in the specified ambient environment and applying a
short duration pulse current (to eliminate self-heating effects)
to the component.
4. The heating current, Idc, is the DC current required to raise the
component temperature by approximately 40°C. The heating cur-
rent is determined by mounting the component on a typical PCB
and applying current for 30 minutes.
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