參數(shù)資料
型號(hào): Pentium III cpu with mobile
廠商: Intel Corp.
英文描述: Pentium III processor Mobile Module Connector 2 (MMC-2)(帶移動(dòng)模塊連接器2奔III處理器)
中文描述: 奔騰III處理器的移動(dòng)模塊連接器2(絲裂霉素2)(帶移動(dòng)模塊連接器2奔三處理器)
文件頁數(shù): 40/64頁
文件大?。?/td> 773K
代理商: PENTIUM III CPU WITH MOBILE
Pentium
III Processor Mobile Module MMC-2
34
Datasheet
245304-003
Figure 6. Power Sequence Timing
5.3.3
Power Planes: Bulk Capacitance Requirements
The placement of sufficient bulk capacitance on the system electronics board is critical to the
operation of the mobile module and to ensure that the system design can accommodate future high
frequency modules. Intel has provided the maximum possible bulk capacitance on the mobile
module. However, in order to achieve proper filtering and in-rush current protection, it is
imperative that additional filtering be provided on the system electronics board.
Table 24
details
the bulk capacitance requirements for the system electronics.
Note:
Observe the voltage rating requirement for the capacitors on each respective voltage rail.
NOTES:
1. PWROK on I/O board should be active on when VR_PWRGD is active and V_3S is good.
2. CPU_RST from I/O board should be active for a minimum of 6.0 mS after PWROK is active and PLL_STP# and CPU_STP# are inactive.
Note that PLL_STP# is an AND condition of RSMRST# and SUSB# on the PIIX4E/M.
3. This is the 5V power supplied to the MMC-2 connector. This should be the first 5.0-V plane to power up. Stays on during suspend.
4. V_DC >= 7.5V, V_5>=4.5V, V_3S>=3.0V.
5. VR_PWRGD is specified active by the module regulator within less than or equal to 6.0-mS maximum after the assertion of VR_ON.
6. V_CPUPU and V_CLK are generated on the mobile module.
V_CPUPU
V_CLK
NOTE 6
NOTE 6
VR_PWRGD
V_DC
V_3
V_5
V_3S
VR_ON
NOTE 4
0 MS MIN
NOTE 3
0 MS MIN
NOTE 5
0 MS MIN
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