參數(shù)資料
型號(hào)： pentium II processor
廠商： Intel Corp.
英文描述： 32 bit processor AT 233MHZ，266MHZ，300MHZ and 333MHZ(工作頻率233，266，300和333兆赫茲32位處理器)
中文描述： 32位處理器，233MHZ，266MHz的的300MHz和333MHz的（工作頻率23326.63萬(wàn)和333兆赫茲32位處理器）
文件頁(yè)數(shù)： 43/94頁(yè)
文件大?。?/td> 892K
代理商： PENTIUM II PROCESSOR
E
PENTIUM II PROCESSOR AT 233 MHZ, 266 MHZ, 300 MHZ, AND 333 MHZ
43
Table 20. Pentium
II Processor Thermal Design Specification
1
Processor
Core
Frequency
(MHz)
L2 Cache
Size
(kB)
Max
Processor
Power
2
(W)
Max
Thermal
Plate
Power
3
(W)
Min T
(°C)
Max T
PLATE
(°C)
Min T
(°C)
Max T
(°C)
333
5
512
23.7
21.8
5
65
5
75
300
4
512
43.0
41.4
5
72
5
72
266
5
512
19.5
17.8
5
65
5
75
266
4
512
38.2
37.0
5
75
5
75
233
4
512
34.8
33.6
5
75
5
75
NOTES:
1.
2.
3.
4.
5.
These values are specified at nominal Vcc
CORE
for the processor core and nominal Vcc
L2
(3.3 V) for the L2 cache.
Processor power is 100% of processor core and 100% L2 cache power.
Thermal plate power is 100% of the processor core power and a percentage of the L2 cache power.
This specification applies to CPU ID 63x.
This specification applies to CPU ID 65x.
4.2.
Pentium
II Processor Thermal
Analysis
4.2.1.
THERMAL SOLUTION
PERFORMANCE
All processor thermal solutions should attach to the
thermal plate.
The thermal solution must adequately control the
thermal plate and cover temperatures below the
maximum and above the minimum specified in
Table 20. The performance of any thermal solution is
defined as the thermal resistance between the
thermal plate and the ambient air around the
processor (
Θ
thermal plate to ambient
). The lower the
thermal resistance between the thermal plate and the
ambient air, the more efficient the thermal solution is.
The required
Θ
thermal plate to ambient
is dependent upon
the maximum allowed thermal plate temperature
(T
PLATE
), the ambient temperature (T
LA
) and the
thermal plate power (P
PLATE
).
Θ
thermal plate to ambient =
(TPLATE – TLA) / PPLATE
The maximum T
PLATE
and the thermal plate power
are listed in Table 20. T
LA
is a function of the system
design. Table 21 provides the resultant thermal
solution performance for a 266 MHz Pentium II
processor at different ambient air temperatures
around the processor.
Table 21. Example Thermal Solution
Performance for 266 MHz Pentium
II
Processor at Thermal Plate Power of
37.0 Watts
Thermal Solution
(Performance)
Local Ambient
Temperature (T
LA
)
35 °C
40 °C
45 °C
Θ
thermal plate to ambient
(°C/watt)
1.08
0.95
0.81
The
Θ
thermal plate to ambient
value is made up of two
primary components: the thermal resistance between
the thermal plate and heatsink (
Θ
thermal plate to heatsink
)
and the thermal resistance between the heatsink and
the ambient air around the processor (
Θ
heatsink to air
).
A critical but controllable factor to decrease the
resultant value of
Θ
thermal
management of the thermal interface between the
thermal plate and heatsink. Thermal interfaces are
addressed
in
AP-586,
Thermal Design Guidelines (Order Number 243333).
The other controllable factor (
Θ
heatsink to air
) is
resultant in the design of the heatsink and airflow
around the heatsink. Heatsink design constraints are
also provided in AP-586, Pentium
II Processor
Thermal Design Guidelines(Order Number 243333).
plate
to
heatsink
is
Pentium
II
Processor
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