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參數(shù)資料
| 型號： | PCF8575TS/1,112 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 11/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC I/O EXPANDER I2C 16B 24SSOP |
| 產(chǎn)品培訓(xùn)模塊： | I²C Bus Fundamentals |
| 特色產(chǎn)品： | NXP - I2C Interface |
| 標(biāo)準(zhǔn)包裝： | 59 |
| 接口： | I²C |
| 輸入/輸出數(shù)： | 16 |
| 中斷輸出： | 是 |
| 頻率 - 時(shí)鐘： | 400kHz |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-SSOP（0.209"，5.30mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-SSOP |
| 包裝： | 管件 |
| 包括： | POR |
| 產(chǎn)品目錄頁面： | 827 (CN2011-ZH PDF) |
| 其它名稱： | 568-3989-5 935276552112 PCF8575TSDB PCF8575TSDB-ND |
1999 Apr 07
19
Philips Semiconductors
Product specication
Remote 16-bit I/O expander for I2C-bus
PCF8575
14.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
HLQFP, HSQFP, HSOP, SMS
not suitable(2)
suitable
PLCC(3), SO
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SQFP
not suitable
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
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