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參數(shù)資料
| 型號： | PCF85103C-2P |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | DRAM |
| 英文描述： | 256 x 8-bit CMOS EEPROMs with I2C-bus interface |
| 中文描述： | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 |
| 封裝： | 0.300 INCH, PLASTIC, DIP-8 |
| 文件頁數(shù)： | 17/20頁 |
| 文件大?。?/td> | 99K |
| 代理商： | PCF85103C-2P |
2000 Feb 15
17
Philips Semiconductors
Product specification
256
×
8-bit CMOS EEPROMs with
I
2
C-bus interface
PCF85102C-2; PCF85103C-2
14.4
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
MOUNTING
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
DIPPING
suitable
suitable
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Surface mount
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
(2)
not suitable
not suitable
(3)
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
相關(guān)PDF資料 |
PDF描述 |
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| PCF85102C-2 | RESN CER CHIP 8.000MHZ0.5% -40 - 85C |
| PCF85102C-2P | 256 x 8-bit CMOS EEPROMs with I2C-bus interface |
| PCF85103C-2 | 256 x 8-bit CMOS EEPROM with I2C-bus interface |
| PCF8570 | 256 x 8-bit static low-voltage RAM with I2C-bus interface |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCF85103C-2P/00,11 | 功能描述:電可擦除可編程只讀存儲器 256X8-BIT CMOS RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 |
| PCF85103C-2P-00 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:256 x 8-bit CMOS EEPROM with I2C-bus interface |
| PCF85103C-2T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:256 x 8-bit CMOS EEPROM with I2C-bus interface |
| PCF85103C-2T/00,11 | 功能描述:電可擦除可編程只讀存儲器 256X8-BIT CMOS 電可擦除可編程只讀存儲器/I2C BUS RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 |
| PCF85103C-2T/00,112 | 制造商:NXP Semiconductors 功能描述: |
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