參數(shù)資料
型號： PCA9674AN,112
廠商： NXP Semiconductors
文件頁數(shù)： 24/40頁
文件大?。?/td> 0K
描述： IC I/O EXPANDER I2C 8B 16DIP
產(chǎn)品培訓(xùn)模塊： LED Controllers
標(biāo)準(zhǔn)包裝： 28
接口： I²C
輸入/輸出數(shù)： 8
中斷輸出： 是
頻率 - 時鐘： 1MHz
電源電壓： 2.3 V ~ 5.5 V
工作溫度： -40°C ~ 85°C
安裝類型： 通孔
封裝/外殼： 16-DIP（0.300"，7.62mm）
供應(yīng)商設(shè)備封裝： 16-DIP
包裝： 管件
包括： POR
其它名稱： 568-4072-5
935282742112
PCA9674AN
PCA9674AN-ND
PCA9674_PCA9674A
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 7 — 30 May 2013
30 of 40
NXP Semiconductors
PCA9674; PCA9674A
Remote 8-bit I/O expander for Fm+ I2C-bus with interrupt
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 26) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 26.
Table 11.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 12.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCA9674APW 功能描述:接口-I/O擴展器 8-BIT I2C FM+ QB GPIO RST PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9674APW,112 功能描述:接口-I/O擴展器 8-BIT I2C FM+ QB RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9674APW,118 功能描述:接口-I/O擴展器 8-BIT I2C FM+ QB RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9674APW,118-CUT TAPE 制造商:NXP 功能描述:PCA9674 Series 5.5 V ?00 mA Remote 8 bit I/O Expander Fm+I2C bus - TSSOP-16
PCA9674APW-T 功能描述:接口-I/O擴展器 8-BIT I2C FM+ QB GPIO INT PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
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