參數(shù)資料
型號(hào)： PCA9553D
廠商： NXP Semiconductors N.V.
元件分類： LED驅(qū)動(dòng)器
英文描述： 4-bit I2C-bus LED driver with programmable blink rates
封裝： PCA9553D/01<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 5, 2005,;PCA9553D/01<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 5,
文件頁(yè)數(shù)： 15/26頁(yè)
文件大小： 146K
代理商： PCA9553D
PCA9553_6
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 29 December 2008
22 of 26
NXP Semiconductors
PCA9553
4-bit I2C-bus LED driver with programmable blink rates
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
16.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 26) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 15 and 16
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 26.
Table 15.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 16.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCA9553D/01 功能描述:LED照明驅(qū)動(dòng)器 LED DRVR 4BIT I2C RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-16N
PCA9553D/01,112 功能描述:LED照明驅(qū)動(dòng)器 LED DRVR 4BIT I2C RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-16N
PCA9553D/01,118 功能描述:LED照明驅(qū)動(dòng)器 4-BIT I2C FM OD LED BLK RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-16N
PCA9553D/01112 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述:
PCA9553D/02 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:4-bit I2C-bus LED driver with programmable blink rates
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