參數(shù)資料
型號(hào): PCA2002T
廠商: NXP SEMICONDUCTORS
元件分類: 時(shí)鐘及定時(shí)
英文描述: 32 kHz watch circuit with programmable output period and pulse width
中文描述: STEPPING MOTOR WATCH, PDFP8
封裝: PLASTIC, SOT-144-1, MFP-8
文件頁(yè)數(shù): 12/20頁(yè)
文件大小: 124K
代理商: PCA2002T
2004 Jan 20
12
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
BONDING PAD LOCATIONS
Notes
1.
All coordinates are referenced, in
μ
m, to the centre of
the die (see Fig.11).
The substrate (rear side of the chip) is connected to
V
SS
. Therefore, the die pad must be either floating or
connected to V
SS
.
Pad i.c. is used for factory tests; in normal operation it
should be left open-circuit, and it has an internal
pull-down resistance to V
SS
.
2.
3.
Table 5
Mechanical chip data; note 1
Note
1.
The substrate of the chip is connected to V
SS
. The
pad i.c. is used for factory test, in normal operation it
should be left open-circuit. The pad i.c. has an internal
pull-down resistor connected to V
SS
.
SYMBOL
PAD
COORDINATES
(1)
x
y
V
SS(2)
i.c.
(3)
OSCIN
OSCOUT
V
DD
MOT1
MOT2
RESET
1
2
3
4
5
6
7
8
480
480
480
480
+480
+480
+480
+480
+330
+160
160
330
330
160
+160
+330
PARAMETER
VALUE
Bonding pad:
metal
opening
96
×
96
μ
m
86
×
86
μ
m
handbook, halfpage
MBL574
0.90 mm
VDD
MOT2
MOT1
RESET
VSS
i.c.
OSCIN
OSCOUT
1.20 mm
P
6
x
y
0
1
2
8
7
5
3
4
0
Fig.11 Bonding pad locations.
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