參數(shù)資料
型號: PCA2000AA
廠商: NXP Semiconductors N.V.
英文描述: 32 kHz watch circuit with programmable adaptive motor pulse
中文描述: 32千赫的可編程自適應脈沖馬達手表電路
文件頁數(shù): 15/19頁
文件大?。?/td> 120K
代理商: PCA2000AA
2003 Dec 17
15
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
adaptive motor pulse
PCA2000; PCA2001
BONDING PAD LOCATIONS
Notes
1.
All coordinates are referenced, in
μ
m, to the centre of
the die (see Fig.13).
Pad TESTisusedforfactorytests;innormaloperation
it should be left open-circuit, and it has an internal
pull-down resistance to V
SS
.
The substrate (rear side of the chip) is connected to
V
SS
. Therefore the die pad must be either floating or
connected to V
SS
.
2.
3.
Table 7
Mechanical chip data; note 1
Note
1.
The substrate of the chip is connected to V
SS
.
SYMBOL
PAD
COORDINATES
(1)
x
y
V
SS(3)
TEST
(2)
OSCIN
OSCOUT
V
DD
MOT1
MOT2
RESET
1
2
3
4
5
6
7
8
480
480
480
480
+480
+480
+480
+480
+330
+160
160
330
330
160
+160
+330
handbook, halfpage
MGW353
0.90 mm
VDD
MOT2
MOT1
RESET
VSS
TEST
OSCIN
OSCOUT
1.20 mm
P
6
P
x
y
0
1
2
8
7
5
3
4
0
Fig.13 Bonding pad locations.
PARAMETER
VALUE
Bonding pad:
metal
opening
Thickness:
chip for bonding
chip for golden bumps
Bumps:
height
96
×
96
μ
m
86
×
86
μ
m
200
±
25
μ
m
270
±
25
μ
m
25
±
5
μ
m
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