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參數(shù)資料
| 型號： | PCA1677U |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 時鐘及定時 |
| 英文描述： | 32 kHz watch circuits using a silver-oxide or a 3 V lithium battery |
| 中文描述： | STEPPING MOTOR WATCH, UUC8 |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 69K |
| 代理商： | PCA1677U |
1998 Apr 03
9
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide
or a 3 V lithium battery
PCA167x series
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook”(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
°
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
°
C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°
C within
6 seconds. Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°
C.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA167XSERIES | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Watch Circuit |
| PCA16XXSERIES | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Watch Circuit |
| PCA-17 | 制造商:General Devices 功能描述:PROTECTIVE COVER 制造商:General Devices 功能描述:PROTECTIVE COVER; Accessory Type:Ventilated Protective Cover; For Use With:D-4001 1.75" Utility Chassis; External Height:16.94"; External Width:16.94"; Features:Ventilated; Material:Aluminum; Thickness:0.06" ;RoHS Compliant: Yes 制造商:GENERAL DEVICES 功能描述:Access Utility Chassis Options |
| PCA-17-S | 制造商:General Devices 功能描述:PROTECTIVE COVER 制造商:General Devices 功能描述:PROTECTIVE COVER; Accessory Type:Solid Protective Cover; For Use With:D-4001 1.75" Utility Chassis; External Height:16.94"; External Width:16.94"; Features:Solid; Material:Aluminum; Thickness:0.06" ;RoHS Compliant: Yes 制造商:GENERAL DEVICES 功能描述:Solid Protective Cover, Sold Individually |
| PCA18-0 | 功能描述:電線鑒定 Pre-Printed Clip-On WM, Non-Adhesive Ace RoHS:否 制造商:TE Connectivity / Q-Cees 產(chǎn)品:Labels and Signs 類型: 材料:Vinyl 顏色:Blue 寬度:0.625 in 長度:1 in |
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