參數(shù)資料
型號(hào)： PC755CVGSU366LE
廠商： ATMEL CORP
元件分類(lèi)： 微控制器/微處理器
英文描述： PowerPC 755/745 RISC Microprocessor
中文描述： 32-BIT, 366 MHz, RISC PROCESSOR, CBGA360
封裝： SOLDER COLUMN INTERPOSER, CERAMIC, BGA-360
文件頁(yè)數(shù)： 18/50頁(yè)
文件大小： 1064K
代理商： PC755CVGSU366LE
18
PC755/745
2138D–HIREL–06/03
Figure 6.
C4 Package with Head Sink Mounted to a Printed-circuit Board
Note the internal versus external package resistance.
Thermal Management
Assistance
The PC755 incorporates a thermal management assist unit (TAU) composed of a ther-
mal sensor, digital-to-analog converter, comparator, control logic, and dedicated
special-purpose registers (SPRs). Specifications for the thermal sensor portion of the
TAU are found in Table 9. More information on the use of this feature is given in the
Motorola PC755 RISC Microprocessor User’s manual.
Notes:
1. The temperature is the junction temperature of the die. The thermal assist unit’s raw
output does not indicate an absolute temperature, but must be interpreted by soft-
ware to derive the absolute junction temperature. For information about the use and
calibration of the TAU, see Motorola Application Note AN1800/D, “Programming the
Thermal Assist Unit in the PC750 Microprocessor”.
2. The comparator settling time value must be converted into the number of CPU clocks
that need to be written into the THRM3 SPR.
3. Guaranteed by design and characterization.
External Resistance
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed ± Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
Table 9.
Thermal Sensor Specifications at Recommended Operating Conditions
(see Table 5)
Characteristic
Min
Max
Unit
°
C
Temperature range
(1)
0
127
Comparator settling time
(2)(3)
20
–
s
Resolution
(3)
4
–
°
C
°
C
Accuracy
(3)
-12
+12
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