參數(shù)資料
型號(hào)： PC755BVZFU400LD
英文描述： MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
中文描述： 微處理器| 32位|的CMOS | BGA封裝| 360PIN |塑料
文件頁(yè)數(shù)： 20/48頁(yè)
文件大小： 276K
代理商： PC755BVZFU400LD
20/48
PC755B/745B
3.4.3. Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (BGA) package for air-cooled applications.
Proper thermal control design is primarily dependent upon the system-level design-the heat sink, airflow and thermal interface mate-
rial. To reduce the die-junction temperature, heat sinks may be attached to the package by several methods–adhesive, spring clip to
holes in the printed-circuit board or package, and mounting clip and screw assembly; see Figure 7. This spring force should not
exceed 5.5 pounds of force.
Adhesive
or
Thermal Interface Material
Heat Sink
Heat Sink
Clip
Printed–Circuit Board
Option
BGA Package
Figure 7 : Package Exploded Cross-Sectional View with Several Heat Sink Options
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air veloc-
ity, spatial volume, mass, attachment method, assembly, and cost.
3.4.3.1. Adhesives and Thermal Interface Materials
0
0.5
1
1.5
2
0
10
20
30
Contact Pressure (psi)
40
50
60
70
80
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
S
Figure 8 : Thermal Performance of Select Thermal Interface Material
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