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參數(shù)資料
| 型號(hào)： | PC29M33AT-T1 |
| 廠商： | NEC Corp. |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR |
| 中文描述： | 三端低壓差電壓調(diào)節(jié)器 |
| 文件頁數(shù)： | 12/16頁 |
| 文件大?。?/td> | 91K |
| 代理商： | PC29M33AT-T1 |
Data Sheet G15368EJ1V0DS
12
μ
PC29M33A,
μ
PC29M05A
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our
sales offices.
For more details, refer to our document
“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E)
.
Surface Mount Device
μ
PC29M33AT,
μ
PC29M05AT: MP-3Z (SC-63)
Process
Conditions
Symbol
Infrared Ray Reflow
Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 2 times or less.
IR35-00-2
Vapor Phase Soldering
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 2 times or less.
VP15-00-2
Wave Soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
WS60-00-1
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Through-hole devices
μ
PC29M33AHF,
μ
PC29M05AHF: MP-45G
μ
PC29M33AHB,
μ
PC29M05AHB: MP-3
Process
Conditions
Wave soldering
(only to leads)
Solder temperature: 260
°C
or below,
Flow time: 10 seconds or less.
Partial heating method
Pin temperature: 300
°C
or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
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