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7.0 Recommended Reflow Temperature Profile
The PA.15 can be assembled following either Sn-Pb or Pb-Free assembly
processes. The recommended soldering temperatures are as follows:
Phase
Profile Features
Sn-Pb Assembly
Pb-Free Assembly
(SnAgCu)
R m  -
Av  R m  -    R
T m  x    T
?/DIV>
n    m  x
?/DIV>
n    m  x
Preheat
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
100?
150?
60-120 seconds
150?
200?
60-180 seconds
Reflow
Temperature (T
L
)
Total Time Above T
L
b(t
L)
183癈
60-150 seconds
217癈
60-150 seconds
Peak
Temperature (Tp)
Time (tp)
235癈
1  -
n
260癈
2  -4
n
R  m  -D wn
R
?/DIV>
n    m  x
?/DIV>
n    m  x
Tim  fr  m 2  ?/DIV>
k T m   r    r
min
m  x
min
m  x
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