參數(shù)資料
型號(hào)： P13252EJ2V0AN00
英文描述： uPC2708TB/2709TB/2710TB. uPC2762TB/2763TB. uPC2771TB/2776TB 6-Pin Super Mini-Mold Silicon Medium-Power High-Frequency Amplifier MMIC
中文描述： uPC2708TB/2709TB/2710TB。 uPC2762TB/2763TB。 uPC2771TB/2776TB 6引腳超小型模具硅中功率高頻單片放大器
文件頁(yè)數(shù)： 7/39頁(yè)
文件大?。?/td> 211K
代理商： P13252EJ2V0AN00
Application Note P13252EJ2V0AN00
7
1. INTRODUCTION
The application for high-frequency devices has grown to include not only TV/VCR tuners and cable TV converters
but also, more recently, DBS, cellular phones, pagers, and GPS. In addition, since the systems are shrinking in size,
the ICs used must also become more compact.
NEC has been selling the silicon medium-power high-frequency amplifier ICs
μ
PC2708 to 2710T,
μ
PC2762/63T,
and
μ
PC2771/76T, which are 6-pin mini-mold products (size 2915). Now, a new lineup of 6-pin super mini-mold
products, which are even smaller, has been released.
This application note introduce application characteristics for the 6-pin super mini-mold silicon medium-power
high-frequency amplifier ICs.
See the data sheet for each product for details of the product’s ratings, specifications, and use conditions.
2. PRODUCT LINEUP
2.1 Characteristics
Table 2-1 shows the lineup of silicon medium-power high-frequency amplifiers, which are the super mini-mold
(size 2012) versions of the existing products, which employ package size 2915.
Table 2-1. 6-Pin Super Mini-Mold Silicon Medium-Power High-Frequency Amplifier MMIC Product Lineup
(T
A
= +25°C, V
CC
= V
out
= 5.0 V or 3.0 V, Z
L
= Z
S
= 50
)
Part Number
(discrete part
number)
V
CC
(V)
f
u
(GHz)
P
O (1dB)
(dBm)
P
O (sat)
(dBm)
G
P
(dB)
NF
(dB)
I
CC
(mA)
Marking
μ
PC2708TB
2.9
+10.0
15
6.5
26
C1D
μ
PC2709TB
2.3
+9.0
+11.5
23
5.0
25
C1E
μ
PC2710TB
1.0
+13.5
33
3.5
22
C1F
μ
PC2776TB
4.5 to 5.5
2.7
+6.5
+8.5
23
6.0
25
C2L
μ
PC2762TB
2.9
+8.0
+9.0
13
6.5
26.5
C1Z
μ
PC2763TB
2.7
+9.5
+11.0
20
5.5
27
C2A
μ
PC2771TB
2.7 to 3.3
2.2
+11.5
+12.5
21
6.0
36
C2H
Remark
The above values are typical values for major characteristics. See each product’s data sheet for
detailed ratings, characteristic, etc.
The same part number is used for the product name. However, “TB” is assigned as the package code for the
super mini-mold model, while “T” is assigned for the conventional mini-mold model. The same chip is used for
products having the same part number, but the lead frame and package size have been changed to smaller one.
Therefore, even though there may be a slight shift in the characteristics due to differences in the lead inductance or
package capacitance, the characteristics obtained for the super mini-mold products are practically equivalent to
those of the conventional mini-mold products since the same chips are used.
The super mini-mold product weighs approximately half as much as the mini-mold product. The weight of the
mini-mold product is 13 mg, while the super mini-mold version is only 7 mg. The markings on the super mini-mold
products use the same symbols as the conventional mini-mold products having the same part numbers, but the
products can be distinguished by their package sizes. Figure 2-1 shows the external view of the 6-pin super mini-
mold package, and Figure 2-2 shows the appearance of the product markings.
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