- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄224630 > OR2C10A-2S352I (Electronic Theatre Controls, Inc.) Field-Programmable Gate Arrays PDF資料下載
參數(shù)資料
| 型號(hào)： | OR2C10A-2S352I |
| 廠商： | Electronic Theatre Controls, Inc. |
| 元件分類： | FPGA |
| 英文描述： | Field-Programmable Gate Arrays |
| 中文描述： | 現(xiàn)場可編程門陣列 |
| 文件頁數(shù)： | 31/192頁 |
| 文件大?。?/td> | 3148K |
| 代理商： | OR2C10A-2S352I |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁當(dāng)前第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁第142頁第143頁第144頁第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁第160頁第161頁第162頁第163頁第164頁第165頁第166頁第167頁第168頁第169頁第170頁第171頁第172頁第173頁第174頁第175頁第176頁第177頁第178頁第179頁第180頁第181頁第182頁第183頁第184頁第185頁第186頁第187頁第188頁第189頁第190頁第191頁第192頁
Lucent Technologies Inc.
126
Data Sheet
June 1999
ORCA Series 2 FPGAs
Package Thermal Characteristics
There are three thermal parameters that are in com-
mon use:
ΘJA, ψJC, and ΘJC. It should be noted that all
the parameters are affected, to varying degrees, by
package design (including paddle size) and choice of
materials, the amount of copper in the test board or
system board, and system airflow.
The data base containing the thermal values for all of
Lucent Technologies’ IC packages is currently being
updated to conform to modern JEDEC standards.
Thus, Table 29 contains the currently available thermal
specifications for Lucent Technologies’ FPGA pack-
ages mounted on both JEDEC and non-JEDEC test
boards. The thermal values for the newer package
types correspond to those packages mounted on a
JEDEC four-layer board (indicated as Note 2 in the
table). The values for the older packages, however, cor-
respond to those packages mounted on a non-JEDEC,
single-layer, sparse copper board (see Note 1). It
should also be noted that the values for the older pack-
ages are considered conservative.
ΘJA
This is the thermal resistance from junction to ambient
(a.k.a. theta-JA, R-theta, etc.).
where TJ is the junction temperature, TA is the ambient
air temperature, and Q is the chip power.
Experimentally,
ΘJA is determined when a special ther-
mal test die is assembled into the package of interest,
and the part is mounted on the thermal test board. The
diodes on the test chip are separately calibrated in an
oven. The package/board is placed either in a JEDEC
natural convection box or in the wind tunnel, the latter
for forced convection measurements. A controlled
amount of power (Q) is dissipated in the test chip’s
heater resistor, the chip’s temperature (TJ) is deter-
mined by the forward drop on the diodes, and the ambi-
ent temperature (TA) is noted. Note that
ΘJA is
expressed in units of °C/watt.
ψJC
This JEDEC designated parameter correlates the junc-
tion temperature to the case temperature. It is generally
used to infer the junction temperature while the device
is operating in the system. It is not considered a true
thermal resistance, and it is defined by:
where TC is the case temperature at top dead center,
TJ is the junction temperature, and Q is the chip power.
During the
ΘJA measurements described above,
besides the other parameters measured, an additional
temperature reading, TC, is made with a thermocouple
attached at top-dead-center of the case. ψJC is also
expressed in units of °C/watt.
ΘJC
This is the thermal resistance from junction to case. It
is most often used when attaching a heat sink to the
top of the package. It is defined by:
The parameters in this equation have been defined
above. However, the measurements is performed with
the case of the part pressed against a water-cooled
heat sink so as to draw most of the heat generated by
the chip out the top of the package. It is this difference
in the measurement process that differentiates
ΘJC
from ψJC.
ΘJC is a true thermal resistance and is
expressed in units of °C/watt.
ΘJB
This is the thermal resistance from junction to board
(a.k.a.,
ΘJL). It is defined by:
where TB is the temperature of the board adjacent to a
lead measured with a thermocouple. The other param-
eters on the right-hand side have been defined above.
This is considered a true thermal resistance, and the
measurement is made with a water-cooled heat sink
pressed against the board so as to draw most of the
heat out of the leads. Note that
ΘJB is expressed in
units of °C/watt, and that this parameter and the way it
is measured is still in JEDEC committee.
ΘJA
TJ
TA
–
Q
--------------------
=
ψJC
TJ
TC
–
Q
--------------------
=
ΘJC
TJ
TC
–
Q
--------------------
=
ΘJB
TJ
TB
–
Q
--------------------
=
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| OR2C10A-2S84 | Field-Programmable Gate Arrays |
| OR2C10A-2S84I | CAP 10PF 100V 10% NP0(C0G) SMD-0805 BULK TIN/LEAD/ALLOY R-MIL-PRF-55681 |
| OR2C10A-2T160I | CAP 10PF 100V 10% NP0(C0G) SMD-0805 BULK TIN/LEAD/ALLOY S-MIL-PRF-55681 |
| OR2C10A-2T208 | Field-Programmable Gate Arrays |
| OR2C10A-2T208I | Field-Programmable Gate Arrays |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| OR2C10A3BA256I-DB | 功能描述:FPGA - 現(xiàn)場可編程門陣列 1024 LUT 256 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| OR2C10A3BA352I-DB | 功能描述:FPGA - 現(xiàn)場可編程門陣列 Use ECP/EC or XP RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| OR2C10A3J160I-DB | 功能描述:FPGA - 現(xiàn)場可編程門陣列 1024 LUT 256 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| OR2C10A3S208I-DB | 功能描述:FPGA - 現(xiàn)場可編程門陣列 1024 LUT 256 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| OR2C10A4BA256-DB | 功能描述:FPGA - 現(xiàn)場可編程門陣列 1024 LUT 256 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。