參數(shù)資料
型號(hào)： OM5428T
廠商： Electronic Theatre Controls, Inc.
英文描述： General purpose triggering circuit
中文描述： 通用觸發(fā)電路
文件頁(yè)數(shù)： 14/16頁(yè)
文件大小： 95K
代理商： OM5428T
2002 Nov 08
14
Integrated Electronic Solutions, Hendon, South Australia
Data Sheet
General purpose triggering circuit
OM5428
13 SOLDERING
13.1
Introduction
There is no soldering method that is
ideal for all IC packages. Wave
soldering is often preferred when
through-hole and surface mounted
components are mixed on one
printed-circuit board. However, wave
soldering is not always suitable for
surface mounted ICs, or for
printed-circuits with high population
densities. In these situations reflow
soldering is often used.
This text gives a very brief insight to a
complex technology. A more in-depth
account of soldering ICs can be found
in our “IC Package Data book” (order
code 9398 652 90011).
13.2
DIP
13.2.1
S
OLDERING
BY
DIPPING
OR
BY
WAVE
The maximum permissible
temperature of the solder is 260
°
C;
solder at this temperature must not be
in contact with the joint for more than
5 seconds. The total contact time of
successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the
seating plane, but the temperature of
the plastic body must not exceed the
specified maximum storage
temperature (T
stg max
). If the
printed-circuit board has been
pre-heated, forced cooling may be
necessary immediately after
soldering to keep the temperature
within the permissible limit.
13.2.2
R
EPAIRING
SOLDERED
JOINTS
Apply a low voltage soldering iron
(less than 24 V) to the lead(s) of the
package, below the seating plane or
not more than 2 mm above it. If the
temperature of the soldering iron bit is
less than 300
°
C it may remain in
contact for up to 10 seconds. If the bit
temperature is between
300 and 400
°
C, contact may be up to
5 seconds.
13.3
SO
13.3.1
R
EFLOW
SOLDERING
Reflow soldering techniques are
suitable for all SO packages.
Reflow soldering requires solder
paste (a suspension of fine solder
particles, flux and binding agent) to be
applied to the printed-circuit board by
screen printing, stencilling or
pressure-syringe dispensing before
package placement.
Several techniques exist for
reflowing; for example, thermal
conduction by heated belt. Dwell
times vary between
50 and 300 seconds depending on
heating method. Typical reflow
temperatures range from
215 to 250
°
C.
Preheating is necessary to dry the
paste and evaporate the binding
agent. Preheating duration:
45 minutes at 45
°
C.
13.3.2
W
AVE
SOLDERING
Wave soldering techniques can be
used for all SO packages if the
following conditions are observed:
A double-wave (a turbulent wave
with high upward pressure followed
by a smooth laminar wave)
soldering technique should be
used.
The longitudinal axis of the
package footprint must be parallel
to the solder flow.
The package footprint must
incorporate solder thieves at the
downstream end.
During placement and before
soldering, the package must be fixed
with a droplet of adhesive. The
adhesive can be applied by screen
printing, pin transfer or syringe
dispensing. The package can be
soldered after the adhesive is cured.
Maximum permissible solder
temperature is 260
°
C, and maximum
duration of package immersion in
solder is 10 seconds, if cooled to less
than 150
°
C within 6 seconds. Typical
dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate
the need for removal of corrosive
residues in most applications.
13.3.3
R
EPAIRING
SOLDERED
JOINTS
Fix the component by first soldering
two diagonally- opposite end leads.
Use only a low voltage soldering iron
(less than 24 V) applied to the flat part
of the lead. Contact time must be
limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other
leads can be soldered in one
operation within 2 to 5 seconds
between 270 and 320
°
C.
相關(guān)PDF資料
PDF描述
OM6215SS TWO POWER MOSFETS IN HERMETIC ISOLATED SIP PACKAGE
OM6216SS TWO POWER MOSFETS IN HERMETIC ISOLATED SIP PACKAGE
OM6217SS TWO POWER MOSFETS IN HERMETIC ISOLATED SIP PACKAGE
OM6214SS TWO POWER MOSFETS IN HERMETIC ISOLATED SIP PACKAGE
OM7502SC DUAL POSITIVE AND NEGATIVE FIXED VOLTAGE REGULATORS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
OM5428TR 功能描述:雙向可控硅 300mA Triac Phase Controller RoHS:否 制造商:STMicroelectronics 開(kāi)啟狀態(tài) RMS 電流 (It RMS):16 A 不重復(fù)通態(tài)電流:120 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開(kāi)啟狀態(tài)電壓: 保持電流（Ih 最大值）:45 mA 柵觸發(fā)電壓 (Vgt):1.3 V 柵觸發(fā)電流 (Igt):1.75 mA 最大工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220AB
OM5448TR 功能描述:LED照明驅(qū)動(dòng)器 1-3.5V 1W LED Boost Driver RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-16N
OM5511,112 制造商:NXP Semiconductors 功能描述:PCD6002 PROGRAMMING ADAPTER FO - Rail/Tube
OM5515,112 制造商:NXP Semiconductors 功能描述:CEIBO MP-51 PROGRAMMER - Rail/Tube
OM5569/NT312D,699 功能描述:DEMO BOARD NTAG I2C 制造商:nxp semiconductors 系列:- 零件狀態(tài):有效 類型:近距離無(wú)線通信 頻率:13.56MHz 配套使用產(chǎn)品/相關(guān)產(chǎn)品:NT3H1101 所含物品:板 標(biāo)準(zhǔn)包裝:1
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*