參數(shù)資料
型號: NUP4304MR6T1G
廠商: ON SEMICONDUCTOR
元件分類: 參考電壓二極管
英文描述: Low Capacitance Diode Array for ESD Protection in Four Data Lines
中文描述: UNIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE
封裝: LEAD FREE, PLASTIC, CASE 318F-05, TSOP-6
文件頁數(shù): 6/6頁
文件大?。?/td> 78K
代理商: NUP4304MR6T1G
NUP4304MR6
http://onsemi.com
6
PACKAGE DIMENSIONS
TSOP6
CASE 318F05
ISSUE L
2
3
4
5
6
D
1
e
b
E
A1
A
0.05 (0.002)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. 318F01, 02, 03 OBSOLETE. NEW
STANDARD 318F04.
C
L
H
E
DIM
A
A1
b
c
D
E
e
L
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0
°
NOM
1.00
0.06
0.37
0.18
3.00
1.50
0.95
0.40
2.75
MAX
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10
°
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0
°
MILLIMETERS
INCHES
NOM
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10
°
MAX
H
E
0.7
0.028
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.95
0.037
mm
inches
SCALE 10:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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Phone
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NUP4303MR6/D
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