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參數(shù)資料
| 型號： | NUF9002FCT1 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 數(shù)據(jù)傳輸濾波器 |
| 英文描述： | Low Capacitance 10 Line EMI Filter with ESD Protection |
| 中文描述： | 10 FUNCTIONS, DATA LINE FILTER |
| 封裝： | CASE 499G-01, FLIP CHIP-25 |
| 文件頁數(shù)： | 1/4頁 |
| 文件大?。?/td> | 132K |
| 代理商： | NUF9002FCT1 |
Semiconductor Components Industries, LLC, 2006
March, 2006
Rev. 1
1
Publication Order Number:
NUF9002FC/D
NUF9002FC
Low Capacitance 10 Line
EMI Filter with ESD
Protection
This device is a ten
line EMI filter array for wireless applications.
Greater than
25 dB attenuation is obtained at frequencies from
900 MHz to 3.0 GHz. ESD protection is provided across all
capacitors.
Features
EMI Filtering and ESD Protection
Integration of 50 Discretes
Provides Protection for IEC61000
4
2 (Level 4)
8.0 kV (Contact)
Flip
Chip Package
Moisture Sensitivity Level 1
ESD Rating: Machine Model = C; Human Body Model = 3B
Pb
Free Package is Available*
Benefits
Reduces EMI/RFI Emissions on a Data Line
Integrated Solution Offers Cost and Space Savings
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
Integrated Solution Improves System Reliability
Applications
LCD for Cell Phones and PDAs
Computers and Printers
Communication Systems
MP3 Players
MAXIMUM RATINGS
(T
A
= 25
°
C unless otherwise noted)
Rating
Symbol
Value
Unit
ESD Discharge
IEC61000
4
2
Contact Discharge
V
PP
8.0
kV
Steady
State Power per Resistor
P
R
100
mW
Steady
State Power per Package
P
T
200
mW
Operating Temperature Range
T
OP
40 to +85
°
C
Storage Temperature Range
T
STG
55 to +150
°
C
Junction Temperature
T
J
+125
°
C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb
Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device
Package
Shipping
ORDERING INFORMATION
NUF9002FCT1
Flip
Chip
3000 Tape & Reel
MARKING DIAGRAM
Flip
Chip
CASE 499G
LOW
PASS FILTER
INPUT
OUTPUT
R
I/O
= 100
C
input
= 28 pF
NUF9002
AYWW
http://onsemi.com
1
2
3
4
5
D
C
B
A
E
O1
O6
GND
IN6
IN1
O2
O7
GND
IN7
IN2
O3
O8
GND
IN8
IN3
O4
O9
GND
IN9
IN4
O5
O10
GND
IN10
IN5
PIN CONFIGURATION
(Ball Side)
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
A1
NUF9002FCT1G
Flip
Chip
(Pb
Free)
3000 Tape & Reel
(Note: Microdot may be in either location)
NUF9002 = Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
= Pb
Free Package
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