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參數(shù)資料
| 型號(hào)： | NUD4001 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | LED驅(qū)動(dòng)器 |
| 英文描述： | High Current LED Driver(高電流LED驅(qū)動(dòng)器) |
| 中文描述： | 高電流LED驅(qū)動(dòng)器（高電流的LED驅(qū)動(dòng)器） |
| 文件頁(yè)數(shù)： | 7/8頁(yè) |
| 文件大?。?/td> | 63K |
| 代理商： | NUD4001 |
NUD4001
http://onsemi.com
7
THERMAL INFORMATION
NUD4001 Power Dissipation
The power dissipation of the SO8 is a function of the pad
size. This can vary from the minimum pad size for soldering
to a pad size given for maximum power dissipation. Power
dissipation for a surface mount device is determined by
T
J(max)
, the maximum rated junction temperature of the die,
R
JA
, the thermal resistance from the device junction to
ambient, and the operating temperature, T
A
. Using the
values provided on the data sheet for the SO8 package, P
D
can be calculated as follows:
TJmax
PD
TA
RJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T
A
of 25
°
C, one can
calculate the power dissipation of the device which in this
case is 1.13 W.
150
°
C
110
°
C
The 110
°
C/W for the SO8 package assumes the use of a
FR4 copper board with an area of 2 square inches with 2 oz
coverage to achieve a power dissipation of 1.13 W. There are
other alternatives to achieving higher dissipation from the
SOIC package. One of them is to increase the copper area to
PD
25
°
C
1.13 W
reduce the thermal resistance. Figure 11 shows how the
thermal resistance changes for different copper areas.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad
. Using a
board material such as Thermal Clad or an aluminum core
board, the power dissipation can be even doubled using the
same footprint.
60
80
100
120
140
160
180
0
1
2
3
4
5
6
7
8
9
10
BOARD AREA (in
2
)
J
°
C
Figure 11. JA versus Board Area
0
50
100
150
200
250
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
R
°
/
TIME (sec)
1S 36.9 sq. mm 0.057 in sq.
1S 75.8 sq. mm 0.117 in sq.
1S 150.0 sq. mm 0.233 in sq.
1S 321.5 sq. mm 0.498 in sq.
1S 681.0 sq. mm 1.056 in sq.
1S 1255.0 sq. mm 1.945 in sq.
Figure 12. Transient Thermal Response
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NUD4001/D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:High Current LED Driver |
| NUD4001DEVB | 功能描述:LED 照明開發(fā)工具 NUD4001 EVAL BRD RoHS:否 制造商:Fairchild Semiconductor 產(chǎn)品:Evaluation Kits 用于:FL7732 核心: 電源電壓:120V 系列: 封裝: |
| NUD4001DR2 | 功能描述:LED照明驅(qū)動(dòng)器 High Current LED RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-16N |
| NUD4001DR2G | 功能描述:LED照明驅(qū)動(dòng)器 MI 60V LED DRVR TR RoHS:否 制造商:STMicroelectronics 輸入電壓:11.5 V to 23 V 工作頻率: 最大電源電流:1.7 mA 輸出電流: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SO-16N |
| NUD4001DR2G-CUT TAPE | 制造商:ON 功能描述:NUD4001 Series 500 mA 30 V Surface Mount High Current LED Driver - SOIC-8 |
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