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參數(shù)資料
| 型號(hào)： | NS5A4684SMNTBG |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 8/8頁 |
| 文件大小： | 0K |
| 描述： | IC ANLG SWITCH DUAL SPDT 10WQFN |
| 標(biāo)準(zhǔn)包裝： | 3,000 |
| 功能： | 開關(guān) |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-WFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 10-WQFN（1.4x1.8） |
| 包裝： | 帶卷 (TR) |
NS5A4684S
http://onsemi.com
8
PACKAGE DIMENSIONS
WQFN10, 1.4x1.8, 0.4P
CASE 488AQ
ISSUE C
MOUNTING FOOTPRINT
10 X
PITCH
1
9 X
SCALE 20:1
0.663
0.0261
0.200
0.0079
0.400
0.0157
0.225
0.0089
2.100
0.0827
1.700
0.0669
0.563
0.0221
mm
inches
A
b
A3
A1
0.08 C
SEATING
PLANE
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
DIM
MIN
MAX
MILLIMETERS
A
1.40 BSC
A1
0.40 BSC
A3
0.70
0.80
b
D
0.30
0.50
E
e
L
L1
0.20 REF
0.00
0.050
PIN 1 REFERENCE
D
A
E
B
0.15 C
2X
0.15 C
2X
0.10 C
C
L1
10
1
3
5
6
0.05 C
0.10 CA B
10 X
e
e/2
L
9 X
0.40
0.60
1.80 BSC
0.15
0.25
M1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
M1
0.00
0.05
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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NS5A4684S/D
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