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MC74VHC1G66
http://onsemi.com
2
Figure 1. Pinout Diagrams
ON/OFF CONTROL
OUT/IN
YA
1
U
IN/OUT XA
1
X 1
Figure 2. Logic Symbol
VCC
IN/OUT XA
OUT/IN YA
ON/OFF
CONTROL
GND
1
2
3
4
5
VCC
IN/OUT XA
OUT/IN YA
ON/OFF
CONTROL
GND
1
2
3
4
6
NC
5
(SC88A, TSOP5)
(UDFN6)
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
VCC
DC Supply Voltage
0.5 to +7.0
V
VIN
Digital Input Voltage
0.5 to +7.0
V
VIS
Analog Output Voltage
0.5 to VCC +0.5
V
IIK
Digital Input Diode Current
20
mA
ICC
DC Supply Current, VCC and GND
+25
mA
TSTG
Storage Temperature Range
*65 to )150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
)150
°C
qJA
Thermal Resistance
SOT235
350
230
°C/W
PD
Power Dissipation in Still Air at 85°CSC705
SOT235
150
200
mW
MSL
Moisture Sensitivity
Level 1
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
VESD
ESD Withstand Voltage
Human Body Model (Note
2)Charged Device Model (Note
4)u2000
u200
N/A
V
ILATCHUP
Latchup Performance
Above VCC and Below GND at 125°C (Note 5) $500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow.
2. Tested to EIA/JESD22A114A.
3. Tested to EIA/JESD22A115A.
4. Tested to JESD22C101A.
5. Tested to EIA/JESD78.