參數(shù)資料
型號: NLAS324USG
廠商: ON SEMICONDUCTOR
元件分類: 多路復用及模擬開關
英文描述: Dual SPST Analog Switch, Low Voltage, Single Supply
中文描述: DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8
封裝: LEAD FREE, US-8
文件頁數(shù): 2/10頁
文件大?。?/td> 124K
代理商: NLAS324USG
NLAS324
http://onsemi.com
2
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage
0.5 to
7.0
V
V
I
V
O
I
IK
I
OK
I
O
DC Input Voltage
0.5 to
7.0
V
DC Output Voltage
0.5 to
7.0
V
DC Input Diode Current
V
I
< GND
V
O
< GND
50
mA
DC Output Diode Current
50
mA
DC Output Sink Current
50
mA
I
CC
I
GND
T
STG
T
L
DC Supply Current per Supply Pin
100
mA
DC Ground Current per Ground Pin
100
mA
Storage Temperature Range
65 to
150
C
Lead Temperature, 1 mm from Case for 10 Seconds
260
C
T
J
Junction Temperature under Bias
150
C
JA
P
D
MSL
Thermal Resistance (Note 1)
250
C/W
Power Dissipation in Still Air at 85 C
250
mW
Moisture Sensitivity
Level 1
F
R
Flammability Rating Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
V
ESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 150
N/A
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow.
2. Tested to EIA/JESD22A114A.
3. Tested to EIA/JESD22A115A.
4. Tested to JESD22C101A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
V
CC
Positive DC Supply Voltage
2.0
5.5
V
V
IN
V
IO
V
IS
T
A
Digital Input Voltage (Enable)
GND
5.5
V
Static or Dynamic Voltage Across an Off Switch
GND
V
CC
V
CC
+125
V
Analog Input Voltage (NO, COM)
GND
V
Operating Temperature Range, All Package Types
55
°
C
t
r
, t
f
Input Rise or Fall Time,
(Enable Input)
V
cc
= 3.3 V + 0.3 V
V
cc
= 5.0 V + 0.5 V
0
0
100
20
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS TIME
TO 0.1% BOND FAILURES
Junction
Temperature C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
N
1
1
10
100
1000
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 2. Failure Rate vs. Time Junction Temperature
TIME, YEARS
T
J
T
J
T
J
T
J
T
J
T
J
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