參數(shù)資料
型號： NLAS1053USG
廠商： ON SEMICONDUCTOR
元件分類： 多路復(fù)用及模擬開關(guān)
英文描述： 2:1 Mux/Demux Analog Switches
中文描述： 2-CHANNEL, SGL ENDED MULTIPLEXER, PDSO8
封裝： 2.10 X 3 MM, LEAD FREE, US-8
文件頁數(shù)： 2/10頁
文件大?。?/td> 127K
代理商： NLAS1053USG
NLAS1053
http://onsemi.com
2
MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Positive DC Supply Voltage
V
CC
0.5 to
+
7.0
V
Digital Input Voltage (Select and Inhibit)
V
IN
0.5
≤
V is
≤
+
7.0
V
Analog Output Voltage (V
CH
or V
COM
)
V
IS
0.5
≤
V is
≤
V
CC
+
0.5
V
DC Current, Into or Out of Any Pin
I
IK
50
mA
Storage Temperature Range
T
STG
65 to
+
150
C
Lead Temperature, 1 mm from Case for 10 Seconds
T
L
260
C
Junction Temperature under Bias
T
J
+
150
C
Thermal Resistance
JA
250
C/W
Power Dissipation in Still Air at 85 C
P
D
250
mW
Moisture Sensitivity
MSL
Level 1
Flammability Rating
Oxygen Index: 30% 35%
F
R
UL 94 V0 @ 0.125 in
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
V
ESD
>
2000
200
N/A
V
Latchup Performance
Above V
CC
and Below GND at 85 C (Note 5)
I
Latchup
±
300
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow.
2. Tested to EIA/JESD22A114A.
3. Tested to EIA/JESD22A115A.
4. Tested to JESD22C101A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Characteristics
Symbol
Min
Max
Unit
Positive DC Supply Voltage
V
CC
2.0
5.5
V
Digital Input Voltage (Select and Inhibit)
V
IN
GND
5.5
V
Static or Dynamic Voltage Across an Off Switch
V
IO
GND
V
CC
V
Analog Input Voltage (CH, COM)
V
IS
GND
V
CC
V
Operating Temperature Range, All Package Types
T
A
55
+
125
°
C
Input Rise or Fall Time
(Enable Input)
V
cc
= 3.3 V
±
0.3 V
V
cc
= 5.0 V
±
0.5 V
t
r
, t
f
0
0
100
20
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS TIME
TO 0.1% BOND FAILURES
Junction
Temperature C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
N
1
1
10
100
1000
TIME, YEARS
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 2. Failure Rate versus
Time Junction Temperature
T
J
°
C
T
J
°
C
T
J
°
C
T
J
°
C
T
J
°
C
T
J
°
C
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