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NIC COMPONENTS CORP.
www
.niccomp.
com
www
.lowESR.
com
www
.RFpassives.
com
www
.SMTmagnetics.
com
Molded Chip Wirewound Inductors
NIN Series
DIMENSIONS (mm)
SIZE B
Applicable Guidelines:
1. Recommended soldering conditions :
Flow (wave): 250
o
C for 5 sec. max. (preheating of 120
o
C for 5 minutes.)
Reflow: 250
o
C for 10 sec. max., total time above 230°C is 40 sec. max. (preheating 150°C ~ 180°C/120 sec. max.)
2. Avoid placing inductor over any metal pattern on the PCB, which may create mutual inductance problems.
3. For mounting, it is suggested to secure chip inductor by means of epoxy adhesive curable by ultraviolet.
4. Ultrasonic cleaning is not recommended. If it is necessary, the cleaning conditions must be examined so as not to create mechanical
damage by unexpected resonant vibration. Please contact our engineering department.
5. An excessive mechanical force may effect the electrical and magnetic properties of chip inductors. Make sure not to use any stress
greater than 2Kg when component is placed.
SIZE A and C
PART MARKING
a
u
d
n
a
T
±
0
2
±
0
1
± %
5
(1) 3 digits system in
μ
H
(2) R indicates decimal point in
μ
H Ex:2R7 = 2.7
μ
H
Ex:R18 = .18
μ
H = 180nH
(3) N indicates nanohenries (0.001
μ
H), Ex: 10N = 0.01
μ
H = 10nH
MARKING
L
W
A
B
H
B
H
MARKING
L
W
A
e
c
e
c
n
n
%
%
r
e
c
n
g
n
M
a
T
e
m
a
x
E
M
c
e
d
M
0
J
0
7
2
2
7
R
4
2
n
o
o
N
J
Inductance Tolerance Code:
M = ±20%, K = ±10%, J = ±5%
Rated inductance in μH (3 digits, first 2 numbers
are significant, R stands for decimal point)
Series-Type
Packaging: TR = Tape & Reel
PART NUMBER SYSTEM
NIN-FA
R47 M TR F
Lead Free/RoHS compliant
(99.3% Sn, 0.7% Cu)