參數(shù)資料
型號: NE570DR2G
廠商: ON Semiconductor
文件頁數(shù): 1/10頁
文件大小: 0K
描述: IC COMPANDOR DUAL GAIN 16-SOIC
標準包裝: 1
類型: 壓縮擴展器
應用: 蜂窩式無線電,播放器
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.295",7.50mm 寬)
供應商設(shè)備封裝: 16-SOIC W
包裝: 剪切帶 (CT)
其它名稱: NE570DR2GOSCT
Semiconductor Components Industries, LLC, 2006
May, 2006 Rev. 4
1
Publication Order Number:
NE570/D
NE570
Compandor
The NE570 is a versatile low cost dual gain control circuit in which
either channel may be used as a dynamic range compressor or
expandor. Each channel has a fullwave rectifier to detect the average
value of the signal, a linerarized temperaturecompensated variable
gain cell, and an operational amplifier.
The NE570 is well suited for use in cellular radio and radio
communications systems, modems, telephone, and satellite
broadcast/receive audio systems.
Features
Complete Compressor and Expandor in One IC
Temperature Compensated
Greater than 110 dB Dynamic Range
Operates Down to 6.0 VDC
System Levels Adjustable with External Components
Distortion may be Trimmed Out
PbFree Packages are Available*
Applications
Cellular Radio
Telephone Trunk Comandor
High Level Limiter
Low Level Expandor Noise Gate
Dynamic Noise Reduction Systems
VoltageControlled Amplifier
Dynamic Filters
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Maximum Operating Voltage
VCC
24
VDC
Operating Ambient Temperature Range
TA
0 to +70
°C
Operating Junction Temperature
TJ
150
°C
Power Dissipation
PD
400
mW
Thermal Resistance, JunctiontoAmbient
RqJA
105
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
DG CELL IN
RECT IN
VREF
1.8 V
THD TRIM
RECT CAP
INVERTER IN
OUTPUT
+
R2 20 kW
R1 10 kW
VARIABLE
GAIN
30 k
W
20 k
W
Figure 1. Block Diagram
RECTIFIER
R3
R4
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
PIN CONNECTIONS
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
ORDERING INFORMATION
(Top View)
SOIC16 WB
D SUFFIX
CASE 751G
RECT_IN_1
RECT_CAP_2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
16
15
RECT_CAP_1
DG_CELL_IN_1
INV_IN_1
GND
RES_R3_1
OUTPUT_1
THD_TRIM_1
RECT_IN_2
DG_CELL_IN_2
VCC
INV_IN_2
RES_R3_2
OUTPUT_2
THD_TRIM_2
1
MARKING
DIAGRAM
16
1
NE570D
AWLYYWWG
A
= Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G
= PbFree Package
Plastic Small Outline Package;
16 Leads; Body Width 7.5 mm
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