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參數(shù)資料
| 型號： | NCV7356D2R2 |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 9/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC TXRX CAN SGL WIRE 14-SOIC |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 類型： | 收發(fā)器 |
| 驅(qū)動器/接收器數(shù)： | 1/1 |
| 規(guī)程： | CAN |
| 電源電壓： | 5 V ~ 27 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 14-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 14-SOICN |
| 包裝： | 帶卷 (TR) |
NCV7356
http://onsemi.com
17
SOIC8 Thermal Information
Parameter
Test Condition, Typical Value
Unit
Min Pad Board
(Note 22)
1, Pad Board
(Note 23)
JunctiontoLead (psiJL7, YJL8) or Pins 67
57
51
°C/W
JunctiontoAmbient (RqJA, qJA)
187
128
°C/W
22.1 oz copper, 53 mm2 coper area, 0.062″ thick FR4.
23.1 oz copper, 716 mm2 coper area, 0.062″ thick FR4.
Package Construction
with and without Mold Compound
Figure 10. Internal construction of the
package simulation.
Figure 11. Min pad is shown as the red traces.
1, pad includes the yellow area. Internal
construction is shown for later reference.
Various copper areas used
for heat spreading
Active Area (red)
Lead #1
0
100
200
300
400
500
600
800
2.0 oz. Cu
Figure 12. SOIC8, qJA as a Function of the Pad Copper
Area Including Traces,
Board Material
q
JA
(°
C/W)
160
Copper Area (mm2)
1.0 oz. Cu
700
150
140
130
120
110
100
190
180
170
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NCV7356D2R2G | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SINGLE WIRE CAN RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| NCV7356DR2 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Single Wire CAN Transceiver |
| NCV7361 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Voltage Regulator with Integrated LIN Transceiver |
| NCV7361A | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Voltage Regulator with Integrated LIN Transceiver |
| NCV7361A_05 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:Voltage Regulator with Integrated LIN Transceiver |
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