參數(shù)資料
型號: NCV7356D2G
廠商: ON Semiconductor
文件頁數(shù): 13/24頁
文件大?。?/td> 0K
描述: IC TXRX CAN SGL WIRE 14-SOIC
標準包裝: 55
類型: 收發(fā)器
驅(qū)動器/接收器數(shù): 1/1
規(guī)程: CAN
電源電壓: 5 V ~ 27 V
安裝類型: 表面貼裝
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
供應商設(shè)備封裝: 14-SOICN
包裝: 管件
NCV7356
http://onsemi.com
20
SOIC14 Thermal Information
Parameter
Test Condition, Typical Value
Unit
Min Pad Board
(Note 24)
1, Pad Board
(Note 25)
JunctiontoLead (psiJL8, YJL8)
30
°C/W
JunctiontoAmbient (RqJA, qJA)
122
84
°C/W
24.1 oz copper, 94 mm2 coper area, 0.062″ thick FR4.
25.1 oz copper, 767 mm2 coper area, 0.062″ thick FR4.
Figure 17. Internal construction of the package
simulation.
Figure 18. Min pad is shown as the red traces.
1 inch pad includes the yellow area. Pin 1, 7, 8 and
14 are connected to flag internally to the package
and externally to the heat spreading area.
60
70
80
90
100
110
120
130
140
150
0
100
200
300
400
500
600
800
2.0 oz. Cu
q
JA
C/W)
Copper Area (mm2)
1.0 oz. Cu
700
Figure 19. SOIC14, qJA as a Function of the Pad Copper Area Including Traces,
Board Material
900
Sim 1.0 oz.
Sim 2.0 oz.
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