參數(shù)資料
型號: NCV2002SN2T1G
廠商: ON Semiconductor
文件頁數(shù): 8/16頁
文件大?。?/td> 0K
描述: IC OPAMP R-R 0.9V 1A 6-TSOP
標準包裝: 1
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 1.3 V/µs
增益帶寬積: 900kHz
電流 - 輸入偏壓: 10pA
電壓 - 輸入偏移: 500µV
電流 - 電源: 820µA
電流 - 輸出 / 通道: 128mA
電壓 - 電源,單路/雙路(±): 0.9 V ~ 7 V,±0.45 V ~ 3.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: SC-74,SOT-457
供應(yīng)商設(shè)備封裝: 6-TSOP
包裝: 剪切帶 (CT)
其它名稱: NCV2002SN2T1GOSCT
NCS2002, NCV2002
http://onsemi.com
16
PACKAGE DIMENSIONS
TSOP6
CASE 318G02
ISSUE V
23
4
5
6
D
1
e
b
E1
A1
A
0.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
c
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN
NOM
MAX
MILLIMETERS
0.90
1.00
1.10
A1
0.01
0.06
0.10
b
0.25
0.38
0.50
c
0.10
0.18
0.26
D
2.90
3.00
3.10
E
2.50
2.75
3.00
e
0.85
0.95
1.05
L
0.20
0.40
0.60
0.25 BSC
L2
0
°
10°
1.30
1.50
1.70
E1
E
RECOMMENDED
NOTE 5
L
C
M
H
L2
SEATING
PLANE
GAUGE
PLANE
DETAIL Z
0.60
6X
3.20
0.95
6X
0.95
PITCH
DIMENSIONS: MILLIMETERS
M
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC
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NCS2002/D
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