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參數(shù)資料
| 型號(hào)： | NCS2200AGEVB |
| 廠商： | ON Semiconductor |
| 文件頁(yè)數(shù)： | 9/17頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL NCS2200A COMP UDFN6 |
| 設(shè)計(jì)資源： | NCS2200AGEVB Bill of Materials NCS2200AGEVB Gerber File NCS2200AGEVB Schematic |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 主要目的： | 比較器，單路 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | NCS2200A |
| 已供物品： | 板 |
| 其它名稱： | NCS2200AGEVBOS |
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NCS2200, NCS2200A, NCV2200
http://onsemi.com
17
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10
B
0.05
A
C
L
5X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
10X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L2
1
3
4
6
DIM MIN
MAX
MILLIMETERS
A
0.45
0.55
A1
0.00
0.05
A3
0.127 REF
b
0.15
0.25
D
1.20 BSC
E
1.00 BSC
e
0.40 BSC
L
0.30
0.40
L1
0.00
0.15
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.22
6X
0.42
6X
1.07
0.40
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L2
0.40
0.50
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NCS2200/D
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